50MICROMETER Search Results

Contextual Info: 10 ELV AND RoHS COMPLIANT. n o te ; 2 REEL : 900 IS / u ->i NUMBER OR CONNECTORS :900 PC S/REE L . U- S 7 - T E 2 LE A D T A P E LE N G TH A x - A & I bB TOP T A P E BONDED PART EM PTY) L J U U U U U U U U U U U PULL OUT DIRECTION I_ A IA T U M B

Contextual Info: DWG. NO. SD -54550-005 DO NOT SCALE DRAWING EC NO. DRWNs CH'K: APPR: EC NO. DRWN: CH'K: APPR: EC NO. DRWN; CH'K: APPR: EC NO. DRWNs CH'K: _ APPRs_ R EV ISED . K EC NO.J200G-2548 DRWN: m.FUJIKURA CH'K: K.ASAKAWA _ APPR- M.FUKUSHIMA

mxj connector FPC

Abstract: MOLEX mxj 1.8 inch
Contextual Info: EN-02JÍ097 MXJ-54 'S D - 5 4 5 5 0 - 0 0 5 s 0.5 N + 0.5 1 0.5(N + I) 0 .5 (N - l)±M5 □ 1X1 0.5 0.5 ' 0 .3 5 0 .5 1 0.5 " 0 .5 ( N - I): +0.04 -0-03 0 .5 “ 0 .3 “ VC'-j^ì (PITCH) -R0.3 Ü g“ 4ffl ce V' CONNECTOR RECOMMENDED P .C.BOARD P A T T E R N DIMENSION (REF.)

mxj .4mm

Contextual Info: EN-02JÍ097 MXJ-54 / 545500Û 5.S 0 s 0.5 N + 0 . 5 ( N + I) 0.5(N- l)±M5 0.5 1 □ 1X1 0.5 0.35 0.51 0.5 ' 0.5 " 0 .5 ( N - I ) : + 0 .0 4 -0 -0 3 0 .5 “ 0 .3 “ VC'-j^ì (PITC H ) -R0.3 Üg“ 4ffl ce V' J S cdF F A P P L IC A B L E FFC RECOMMENDED DIMENSION

IEC-60286-3 peel 0.7

Contextual Info: 10 TE CONTACT / / / / / / / / / / / / / '/ / / / / / / / // / v ////\ P 0 IN T (B 0 T T 0 M SIDE) L_, ( .7) LENGTH TO (3. 6) CONTACT E O IN T F P CM AxJSS IN S E R T IO N DFPTH OP FPC SECT. J-J SCALE 5: (6.55) (WHEN AC TU ATO R IS OPENED) (WHEN AC TU ATO R

SD-54104-077

Contextual Info: 10 0.5 N ^ 0.5(N- 0 .5 0.5~ 0.3~ 0 .5 ctT-R» (PITCH Q cc c o CD ï i fr 4ffl LÜ tF F C Í« ^ ;Í CONNECTOR POSITION RECOMMENDED P.W .BOARD ( V r) y 0 .3 5 M AX. PATTERN D IM E N i (f± ± ^DJ¥$ h ffi) (M O U N T IN G APPLICABLE FF C OF GOLD PLATING RECOMMENDED DIMENSION

Contextual Info: 10 0.5 Nu 0 .5 (N 0.5 0 .5 (N - 0 .5 “ 0 .3 “ A Y (F3 F (PITCH) 3 f □ QL < O 3 CD / 33 cr Tffl LU A F f 8 RECOMMENDED P.W.BOARD PATTERN DIMENSICMREF.I ( v A v h ffi) (MOUNTING SIDE) 0.35 MAX. /'• V - V WY V’ 7 IA A I F P C ftS tA W APPLICABLE FPC OF GOLD PLATING

Contextual Info: 10 3.3 □. 5 N-1 i0-05 0.9 2.3 0.5(N + I)- 0 =5(N+ IF 3.3 2.3 0.5~ 0.8 0.9 □V X YVZ ( v 3 v h ffi) ( f f ± /A 0 IT i (MOUNTING SIDE) 0.35 MAX ^ 9 -viiX X / (PITC H ) Q CO < o Le$ m 4ffl u in ^ U S O LD ER IN G A R E A OF F IT T IN G N AIL DETAIL P PATTERN

Contextual Info: 10 0.5 N ^ 0.5(N- 0 .5 0.5~ 0.3~ 0 .5 (PITCH Q cn c o CD ï i fr 4ffl LÜ tF F C Í« ^ ;Í CONNECTOR POSITION RECOMMENDED P.W .BOARD ( V r) y 0 .3 5 M AX. PATTERN D IM E N i (f± ± ^DJ¥$ h ffi) (M O U N T IN G APPLICABLE FF C OF GOLD PLATING RECOMMENDED DIMENSION