Untitled
Abstract: No abstract text available
Text: 10 ELV AND RoHS COMPLIANT. n o te ; 2 REEL : 900 IS / u ->i NUMBER OR CONNECTORS :900 PC S/REE L . U- S 7 - T E 2 LE A D T A P E LE N G TH A x - A & I bB TOP T A P E BONDED PART EM PTY) L J U U U U U U U U U U U PULL OUT DIRECTION I_ A IA T U M B
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SD-501786-008
35MICROMETER
50MICROMETER
EN-02DA
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Untitled
Abstract: No abstract text available
Text: r\>,n> o i o> oui U 1.0 REVISED E CN O : J2011-0507 mD R W N :S HIR A T A 2010/10/12 C H 'K D :K TA K A H A S H I 2010/10/12 A P P R :K M O R IK A W A 2010/10/13 > o > o > cx > TOP' zx po O on " X □» (X ex ox pH mX DESCRIPTION > o mL on ; X on ml X 02
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A2010/10/12
A2010/10/13
SD-503480-002
EN-02DA
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SD-50348
Abstract: 5034800800 sd 13005 h10m 503480-1200
Text: 10 0 . 7 9 ±0.05 ].05 0.5 N - .7 9 ±0.05 1 5 ±0.05 (P IT C H □ í. I.3 ±0.05 ? CONNECTOR POSITION i (1.58) ( 1. 0 0 .3 ±0.05 ) n C T 7 IIMKtj fT -U h( 0 . 2 5 ) N d i» N:CIRCUIT: j/ ? : 0.1mm BflnSP: T E R M . ( 0 . 7 X 0 . 3 ) N A IL d .0X 0.3)
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503A80-2000
503A80-1700
503A80-1600
503A80-1A00
503A80-1200
503AKED
50348t
SD-503480-002
EN-02DAÃ
SD-50348
5034800800
sd 13005
h10m
503480-1200
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IEC-60286-3 peel 0.7
Abstract: No abstract text available
Text: 10 TE CONTACT / / / / / / / / / / / / / '/ / / / / / / / // / v ////\ P 0 IN T (B 0 T T 0 M SIDE) L_, ( .7) LENGTH TO (3. 6) CONTACT E O IN T F P CM AxJSS IN S E R T IO N DFPTH OP FPC SECT. J-J SCALE 5: (6.55) (WHEN AC TU ATO R IS OPENED) (WHEN AC TU ATO R
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SD-54132-065
EN-02JA
IEC-60286-3 peel 0.7
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SD-54104-077
Abstract: No abstract text available
Text: 10 0.5 N ^ 0.5(N- 0 .5 0.5~ 0.3~ 0 .5 ctT-R» (PITCH Q cc c o CD ï i fr 4ffl LÜ tF F C Í« ^ ;Í CONNECTOR POSITION RECOMMENDED P.W .BOARD ( V r) y 0 .3 5 M AX. PATTERN D IM E N i (f± ± ^DJ¥$ h ffi) (M O U N T IN G APPLICABLE FF C OF GOLD PLATING RECOMMENDED DIMENSION
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UL94V-0
5D-54-104-078
EN-02JAI021)
SD-54104-077
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Untitled
Abstract: No abstract text available
Text: 10 0.5 Nu 0 .5 (N 0.5 0 .5 (N - 0 .5 “ 0 .3 “ A Y (F3 F (PITCH) 3 f □ QL < O 3 CD / 33 cr Tffl LU A F f 8 RECOMMENDED P.W.BOARD PATTERN DIMENSICMREF.I ( v A v h ffi) (MOUNTING SIDE) 0.35 MAX. /'• V - V WY V’ 7 IA A I F P C ftS tA W APPLICABLE FPC OF GOLD PLATING
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35MICROMETER
5Y10Y-*
5D-5A10A-078_
EN-02JA
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Untitled
Abstract: No abstract text available
Text: 10 3.3 □. 5 N-1 i0-05 0.9 2.3 0.5(N + I)- 0 =5(N+ IF 3.3 2.3 0.5~ 0.8 0.9 □V X YVZ ( v 3 v h ffi) ( f f ± /A 0 IT i (MOUNTING SIDE) 0.35 MAX ^ 9 -viiX X / (PITC H ) Q CO < o Le$ m 4ffl u in ^ U S O LD ER IN G A R E A OF F IT T IN G N AIL DETAIL P PATTERN
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i0-05
SD-5Z132-065
EN-02JA
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Untitled
Abstract: No abstract text available
Text: 10 DENOTES MATERIAL AU75 K PA . *-7^51«. UL9YV-0HOUSINGrPOLYAMIDE,GLASS FILLED,UL9LV-0,NATURAL I WHITE ) T9 +s.^-9'.*')->j.-\s'sni\*7 7 4 K (PPS ) . UL94V-0 . £ ACTUATORrPOLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK ? - ; +* : '7 (t=0.2) TERMINAL:PHOSPHOR BRONZE
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UL94V-0
UL94V-0
PH05PH0R
SD-52745-056
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Untitled
Abstract: No abstract text available
Text: 10 0.5 N ^ 0.5(N- 0 .5 0.5~ 0.3~ 0 .5 (PITCH Q cn c o CD ï i fr 4ffl LÜ tF F C Í« ^ ;Í CONNECTOR POSITION RECOMMENDED P.W .BOARD ( V r) y 0 .3 5 M AX. PATTERN D IM E N i (f± ± ^DJ¥$ h ffi) (M O U N T IN G APPLICABLE FF C OF GOLD PLATING RECOMMENDED DIMENSION
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35MICROM
SD-54104-078_
EN-02JA
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PDF
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