CLCC 84
Abstract: plcc20 socket HQFP-208 HW-137-DIP8 plcc 68 prom universal programmer XC9500 HW-130 XC1700 HW-133-PG144
Text: November 12, 1997 Version 1.2 HW-130 Programmer 9* HW-130 Programmer Device and Package Support Programming Socket Adapters • XC1700 Serial PROMs • XC9500 CPLDs • Supports all Xilinx package types • Programmer Accessories Supports all package styles: PLCC, PQFP, TQFP,
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HW-130
XC1700
XC9500
HW-133-PC44
HW-133-PQ44
HW-133-VQ44
HW-133-PC68
HW-133-PC84
HW-133-PQ100
CLCC 84
plcc20 socket
HQFP-208
HW-137-DIP8
plcc 68 prom
universal programmer
HW-133-PG144
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Untitled
Abstract: No abstract text available
Text: Tactile Switches Product Selection Guide Series KMT2 KMT0 KMR2-4 Size on PCB L x W mm 3 X 2,6 3 X 2,6 4,2 x 2,8 4,2 x 3,55 5,2 x 5,2 B Total Height (mm) 0,65 0,65 1,9 2,5 1,42 0,8 and 1,5 Tactile Switches Surface Mount Travel (mm) 0,15 0,15 0,2 to 0,35 0,25 to 0,3
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CLCC 84
Abstract: CLCC 84 SOCKET CLCC 44 HW-133-PC68 clcc 44 socket XC7200A DIMENSIONS PQFP 132 XC7300 HW-133-PG144 PGA package weight
Text: HW-130 Programmer August 6, 1996 Version 1.1 Programs All Xilinx Nonvolatile Devices Programming Socket Adapters • • • • • XC1700 Serial PROMs XC7000 CPLDs XC9500 CPLDs Supports all Xilinx package types Programmer Accessories • • • •
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HW-130
XC1700
XC7000
XC9500
RS-232
XC7200A
CLCC 84
CLCC 84 SOCKET
CLCC 44
HW-133-PC68
clcc 44 socket
XC7200A
DIMENSIONS PQFP 132
XC7300
HW-133-PG144
PGA package weight
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SMD 5050 rgb
Abstract: smd 5050 RGB datasheet 5050 RGB smd smd 3528 SMD plcc2 3528 SMD plcc2 5050 white SMD 5060 RGB SMD 5060 RGB DATASHEET SMD 5060
Text: 2007 Product Offerings Thank you for your interest in YELLS! Yokohama Electron is proud to present our 2007 Product Offering Announcement. This announcement is intended for your product identification and sourcing purposes as part of Yokohama Electron’s effort to keep you up to date with our
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HW-137-DIP8
Abstract: XC9500XL CSP-48 HQFP-208 PLCC20 PLCC20 package plcc20 socket PLCC44 socket PLCC-84 tqfp 44 socket
Text: HW-130 Programmer R November 27, 1998 Version 1.4 8* Device and Package Support Programming Socket Adapters • • • • XC1700 Serial PROMs XC9500 CPLDs Supports all Xilinx package types • Programmer Accessories • • • • • • Universal power supply
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HW-130
XC1700
XC9500
HW-137-LCC44/VQ44
HW-130-CAL
HW-133-PQ160
HW-137-LCC44/VQ44
XC7200/7300
XC9500/XL
HW-137-DIP8
XC9500XL
CSP-48
HQFP-208
PLCC20
PLCC20 package
plcc20 socket
PLCC44 socket
PLCC-84
tqfp 44 socket
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TSOP 66 Package
Abstract: TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A
Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability
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32D6/DW6
40D6/DW6
28L/LW
32L/LW
44L/LW
68L/LW
28K/KW
32K/KW
44K/KW
TSOP 66 Package
TSOP 66 Package thermal resistance
CERAMIC LEADLESS CHIP CARRIER
28P6
DW67
0636A
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44 VQFP package
Abstract: HW-137-DIP8 vqfp 44 XC17S00 HW-133-PQ160 PLCC20 package plcc20 socket PLCC44 socket tqfp 64 socket HW-130
Text: R HW-130 Programmer DS019 v1.5 January 13, 2000 8* Product Specification Device and Package Support Programming Socket Adapters • • • • • XC1700 Serial PROMs XC1800 Serial PROMs XC9500/XL CPLDs Supports all Xilinx package types • Electrical Requirements and Physical
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HW-130
DS019
XC1700
XC1800
XC9500/XL
XC9500
HW-137-LCC44/VQ44
XC7200/7300
44 VQFP package
HW-137-DIP8
vqfp 44
XC17S00
HW-133-PQ160
PLCC20 package
plcc20 socket
PLCC44 socket
tqfp 64 socket
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TSOP 66 Package thermal resistance
Abstract: 7244k 20P3 28P6 TSOP 66 thermal resistance
Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability
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28K/KW
32K/KW
44K/KW
68K/KW
24C/CW
TSOP 66 Package thermal resistance
7244k
20P3
28P6
TSOP 66 thermal resistance
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HW-137-DIP8
Abstract: XC1800 HW-130-J plcc20 socket PLCC44 socket Programmer HW-130 XC18V00 HW-130 XC1700 HW-130 Programmer
Text: ds019_1_6.fm Page 1 Tuesday, April 8, 2003 4:07 PM R HW-130 Programmer DS019 v1.6 April 8, 2003 Product Specification Device and Package Support Programmer Functional Specifications • • • • • • • • • • • • XC1700 Serial PROMs XC18V00 ISP PROMs
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HW-130
DS019
XC1700
XC18V00
XC9500/XL
XC7200/7300
XC1800
HW-137-DIP8
HW-130-J
plcc20 socket
PLCC44 socket
Programmer HW-130
HW-130 Programmer
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XCR3000XL
Abstract: vqfp 44 HW-137-DIP8 HQFP HW-133-BG256 HW-136-VQ100 vqfp44 HW-137-PC44/VQ44 HW-136-CS144 xc17v00
Text: HW-130 Programmer R DS019 v1.8 May 25, 2007 Product Specification Device and Package Support Programmer Functional Specifications • XC1700/XC17S00/XL Serial PROMs • Device programming, erasing, and verification • XC17V00/XC17S00A Serial PROMs • CPLD security control
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HW-130
DS019
XC1700/XC17S00/XL
XC17V00/XC17S00A
XC18V00
XC9500/XL/XV
XCR3000XL
XC7200/7300
XC9500/XL
XC1800
vqfp 44
HW-137-DIP8
HQFP
HW-133-BG256
HW-136-VQ100
vqfp44
HW-137-PC44/VQ44
HW-136-CS144
xc17v00
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PICDEM-3
Abstract: DM163003 200B PIC16C923 PIC16C924 PIC16C9XX PIC16CXX
Text: PICDEM-3 Low-Cost PIC16C9XX Demonstration Board PRODUCT INFORMATION The PICDEM-3 is a simple board which demonstrates the capabilities of Microchip’s microcontroller LCD family. All necessary hardware is included to run basic demo programs, which are supplied on a 3.5" disk. A
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PIC16C9XX
40-pin
D-81739
DS51078A-page
PICDEM-3
DM163003
200B
PIC16C923
PIC16C924
PIC16CXX
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20P3
Abstract: 28P6 ATMEL 40T
Text: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability
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0636B
10/98/xM
20P3
28P6
ATMEL 40T
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HW-137-DIP8
Abstract: soic-20 XCN07022 XCR3000XL HW-133-PC44 HW-130-J HW-137-PC44/VQ44 XC18V00 XC7200 HW-130
Text: R HW-130 Programmer DS019 v1.9 February 8, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07022, Product Discontinuation Notice, for more information on last-time purchases and replacement products. Device and Package Support
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HW-130
DS019
XCN07022,
XC1700/XC17S00/XL
XC17V00/XC17S00A
XC18V00
XC9500/XL/XV
XCR3000XL
HW-137-DIP8
soic-20
XCN07022
HW-133-PC44
HW-130-J
HW-137-PC44/VQ44
XC7200
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Untitled
Abstract: No abstract text available
Text: 28C04A 4K 512 x 8 CMOS EEPROM PACKAGE TYPES 32 Vcc 31 WE Vcc A8 NC WE OE NC CE I/O7 I/O6 I/O5 I/O4 I/O3 5 29 A8 6 28 NC 7 27 NC 28C04A 8 9 10 11 26 NC 25 OE 24 NC 23 CE 20 19 18 21 I/O6 17 22 I/O7 13 15 12 14 A6 A5 A4 A3 A2 A1 A0 NC I/O0 2 NC 1 NU PLCC 24
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28C04A
Time--150
Time--200
DS11126F-page
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PIC16C76
Abstract: PIC16C77 200B RC6 philips RB54
Text: 30566A.FRM Page 1 Thursday, December 12, 1996 4:23 PM PIC16C76/77 EPROM-Based 8-Bit Microcontroller Product Brief Device Program Memory Data Memory Pins 8-Bit A/D CCP SSP USART PSP PIC16C76 8K x 14 368 x 8 28 5 ch* 2 Yes Yes No PIC16C77 8K x 14 368 x 8 40-44
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0566A
PIC16C76/77
PIC16C76
PIC16C77
DS30566A-page
PIC16C76
PIC16C77
200B
RC6 philips
RB54
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28C64A
Abstract: 28C64A-15
Text: 28C64A 64K 8K x 8 CMOS EEPROM 30 NC 32 Vcc 31 WE 2 RDY/BSY 1 NU 29 A8 28 A9 27 A11 26 NC 25 OE 24 A10 23 CE 22 I/O7 20 19 18 17 16 15 21 I/O6 14 Vcc WE NC A8 A6 5 A9 A5 6 A11 A4 7 A3 8 OE A10 A2 9 A1 10 CE A0 11 I/O7 NC 12 I/O6 I/O0 13 I/O5 I/O4 I/O3 PLCC
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28C64A
DS11109H-page
28C64A
28C64A-15
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200B
Abstract: 27C512-12 27C512-15 27C512A
Text: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for
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27C512A
DS11173E-page
200B
27C512-12
27C512-15
27C512A
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AX251
Abstract: Intel 82930 USB test board DIL40 MQFP44 OMF251 PLCC44 TSC80251 temic can bus gateway
Text: AX251 In-Circuit Emulator The AX Class For The MCS 251 With Bondout Technology ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
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AX251
AX251
AX251,
TSC80251
Bo-AX251
Intel 82930 USB test board
DIL40
MQFP44
OMF251
PLCC44
temic can bus gateway
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outline pro 408
Abstract: TEXTOOL 40 pin socket PIC16C54A PIC16C55 PIC16C56 AC144001 AC144002 AC164001 PLCC SOCKET 3M AC164015
Text: PRO MATE/PRO MATE II DEVICE SUPPORT Socket Modules INTRODUCTION This document lists the part numbers for the socket modules that support each device and discusses the life expectancy and cleaning procedures for the different socket types. These sockets work on both PRO MATE
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DS30243C-page
outline pro 408
TEXTOOL 40 pin socket
PIC16C54A
PIC16C55
PIC16C56
AC144001
AC144002
AC164001
PLCC SOCKET 3M
AC164015
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XC1700
Abstract: 200B 37LV128 37LV36 37LV65
Text: 37LV36/65/128 36K, 64K, and 128K Serial EPROM Family FEATURES DATA 1 8 VCC CLK 2 7 VPP RESET/OE 3 6 CEO CE 4 5 VSS DATA 1 8 VCC CLK 2 7 VPP RESET/OE 3 6 CEO CE 4 5 VSS SOIC 37LV36 37LV65 37LV128 PLCC Bits Programming Word 37LV36 36,288 1134 x 32 37LV65 65,536
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37LV36/65/128
37LV36
37LV65
37LV128
XC1700
200B
37LV128
37LV36
37LV65
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EC1204
Abstract: WHA300 smd led 5060 CQFP24 SMD 5060 LED WRS3000 PLCC18 KDS824A WRS7000 C881
Text: Weller Cooper Tools Rework Systems WHA300 Self-Contained Hot Air Station c c c c c c c c c Compact Size with Power A Low Cost Self-Contained Hot Air Station Temperature Control: 125¡F-1022¡F Dimensions: 8.5" ´ 5.13" Dia. Current 120 VAC, 50-60 Hz Air Flow: Adjustable from 10 Liters/Min. to 50 Liters/Min.
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WHA300
WRS5000
c0-100
KDS808.
EC1204
984Q1404.
WRS4000.
smd led 5060
CQFP24
SMD 5060 LED
WRS3000
PLCC18
KDS824A
WRS7000
C881
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Untitled
Abstract: No abstract text available
Text: O K I Semiconductor MSC23S136B/BL-XXBS12/DS12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI M SC 23S136B /B L -xxB S12/D S12 is a fully decoded 1,048,576-word x 36-bit CM OS dynamic Ran dom Access M em ory module com posed of eight 4-M b DRAM s in SOJ M SM 514400B/BL packages and
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OCR Scan
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MSC23S136B/BL-XXBS12/DS12
576-Word
36-Bit
23S136B
S12/D
514400B/BL)
511000B/BL)
72-pin
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oa-1160
Abstract: MSC23136 2k240
Text: O K I Semiconductor M SC 23136B/BL-XXBS 12/DS 12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode D ESC R IPTIO N The OKI M SC 23136B/BL -xxBS12/D S12 is a fully decoded 1,048,576-word x 36-bit CM OS Dynamic Ran dom Access Memory M odule composed of eight 4-Mb DRAMs in SOJ M SM 514400B/BL packages and
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OCR Scan
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MSC23136B/BL-xxBS12/DS12
576-Word
36-Bit
MSC23136B/BL-xxBS12/DS12
MSM514400B/BL)
MSM511000B/BL)
72-pin
oa-1160
MSC23136
2k240
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TT 104 N 14 KOF
Abstract: SC2313
Text: O K I Semiconductor MSC23136B/BL-xxBS12/DS12 1,048,576-Word by 36-Bit DRAM Module: Fast Page Mode DESCRIPTION The OKI MSC23136B/BL-xxBS12/DS12 is a fully decoded 1,048,576-word x 36-bit CMOS Dynamic Ran dom Access Memory M odule composed of eight 4-Mb DRAMs in SOJ MSM514400B/BL packages and
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OCR Scan
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MSC23136B/BL-xxBS12/DS12
576-Word
36-Bit
MSC23136B/BL-xxBS12/DS12
MSM514400B/BL)
MSM511000B/BL)
72-pin
TT 104 N 14 KOF
SC2313
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