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    48 LEAD CERAMIC QUAD FLATPACK Search Results

    48 LEAD CERAMIC QUAD FLATPACK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC74HC08AP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Quad 2-Input/AND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    TC74HC00AP Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Quad 2-Input/NAND, DIP14 Visit Toshiba Electronic Devices & Storage Corporation
    0603CS-5N6XJAW Coilcraft Inc 0603CS (1608) Ceramic Chip Inductors Visit Coilcraft Inc Buy
    0603CS-R47XGLU Coilcraft Inc 0603CS (1608) Ceramic Chip Inductors Visit Coilcraft Inc Buy
    0402HL-681XJRW Coilcraft Inc General Purpose Inductor, 0.68uH, 5%, Ceramic-Core, 0503, Visit Coilcraft Inc

    48 LEAD CERAMIC QUAD FLATPACK Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    48 Lead Ceramic Quad Flatpack

    Abstract: CERAMIC QUAD FLATPACK CQFP 96 CERAMIC QUAD FLATPACK CQFP
    Text: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R48.A D S 48 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S INCHES D S D SYMBOL D1 A PIN NO. 1 L e A A -AE1 E e2 -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS


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    CERAMIC QUAD FLATPACK CQFP

    Abstract: 8361H CY7C37512P208B-UM
    Text: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


    Original     		160/208-pin 160/208-lead 160-lead 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP 8361H CY7C37512P208B-UM PDF

    Z84C0010PEC

    Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
    Text: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)


    Original     		CPS95CO0125 Z84C0010PEC MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead PDF

    CERAMIC QUAD FLATPACK CQFP

    Abstract: No abstract text available
    Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997


    Original     		160-pins 160-pin 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


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    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


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    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 PDF

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.B 48 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 0, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.016) BSC PIN 1


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    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    maxim naming convention

    Abstract: AEC-Q100 MAX631ACPA MAX696CWE 81h44 48 Lead Ceramic Quad Flatpack
    Text: Maxim Product Naming Conventions These conventions apply to Maxim-branded products. For Dallas parts, see Dallas Semiconductor Ordering Information Product Numbers for Second-Sourced Parts Second-source products follow the most widely accepted numbering system for that


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    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package PDF

    KD 2107

    Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C


    Original     		A5580-01 KD 2107 A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS PDF

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1


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    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


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    CY37032

    Abstract: CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		Ultra37000 CY37256P160-154AXC, CY37256P160-125AXC, CY37256P160-125AXI, CY37256P160-83AXC, CY37256P160-83AXI, CY37032VP44-143AXC, CY37032VP44-100AXC, CY37032VP44-100AXI, CY37032VP44-100JXI, CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512 PDF

    5962-9951902QYA

    Abstract: CY37128P100-125AXC U208 5962-9952301QZC CERAMIC LEADLESS CHIP CARRIER CY37032P44-125JXC CY37512P256-100BGI CY37192 CY37256 CY37384
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		Ultra37000 CY37128P160-100AXC, CY37128P100-100AXI, CY37192P160-154AXC, CY37192P160-125AXC, CY37192P160-125AXI, CY37192P160-83AXC, CY37192P160-83AXI, CY37256P160-154AXC, CY37256P160-125AXC, 5962-9951902QYA CY37128P100-125AXC U208 5962-9952301QZC CERAMIC LEADLESS CHIP CARRIER CY37032P44-125JXC CY37512P256-100BGI CY37192 CY37256 CY37384 PDF

    CY37032P44-154AXI

    Abstract: CY37128P160-125AC 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		Ultra37000 proY37192P160-83AXI, CY37256P160-154AXC, CY37256P160-125AXC, CY37256P160-125AXI, CY37256P160-83AXC, CY37256P160-83AXI, CY37032VP44-143AXC, CY37032VP44-100AXC, CY37032VP44-100AXI, CY37032P44-154AXI CY37128P160-125AC 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 PDF

    Untitled

    Abstract: No abstract text available
    Text: •A M I Packaging Availability AMERICAN MICROSYSTEMS, INC. August 1996 AMI offers you space-saving and cost-effective packages and package processes spanning a broad spectrum of capabilities. AMI can meet your package requirements in a variety of ways. You can choose from ten basic package


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    GDFP1-F14

    Abstract: No abstract text available
    Text: Philips Semiconductors Military FAST Products Product specification Quad two-input NAND buffer 54F37 ORDERING INFORMATION DESCRIPTION ORDER CODE FUNCTION TABLE PACKAGE DESIGNATOR* 14-Pin Ceramic DIP 54F37/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F37/BDA GDFP1-F14


    OCR Scan     		54F37 14-Pln 54F37/BCA GDIP1-T14 14-Pin 54F37/BDA GDFP1-F14 20-Pin 54F37/B2A CQCC2-F20 GDFP1-F14 PDF

    64-pin CERAMIC QUAD FLATPACK

    Abstract: CY7C690 CY7C964-NC
    Text: CY7C964 Bus Interface Logic Circuit address and data buses, particularly VME­ bus interfaces. The on-chip drivers are suit­ able for driving the VMEbus directly. The CY7C964 is ideal in applications where high-performance and real estate are pri­ mary concerns.


    OCR Scan     		CY7C964 64-pin 68-pin VIC64I7C964 64-pin CERAMIC QUAD FLATPACK CY7C690 CY7C964-NC PDF

    Cypress VMEbus Interface Handbook

    Abstract: G68 Package QFP 64 Cavity dip CY7C960 CY7C961 CY7C964 CY7C964-ASC CY7C964-GMB CY7C964-UMB VIC068A
    Text: fax id: 5604 CY7C964 Bus Interface Logic Circuit Features ler. In every case, the controllers provide the control and timing signals to the Bus Interface Logic Circuit as it acts as a bridge between the VMEbus and the Local bus. • Comparators, counters, latches, and drivers minimize


    OCR Scan     		64-pin 68-pin CY7C964 Cypress VMEbus Interface Handbook G68 Package QFP 64 Cavity dip CY7C960 CY7C961 CY7C964-ASC CY7C964-GMB CY7C964-UMB VIC068A PDF

    CY7C964-UM

    Abstract: CY7C964A-GMB QFP 64 Cavity CERAMIC QUAD FLATPACK CQFP CY7C964-AC Cypress VMEbus Interface Handbook G68 Package CY7C960 CY7C961 CY7C964
    Text: fax id: 5604 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit comparator for slave address decoding


    OCR Scan     		64-pin 68-pin CY7C964 0Q213ag CY7C964-UM CY7C964A-GMB QFP 64 Cavity CERAMIC QUAD FLATPACK CQFP CY7C964-AC Cypress VMEbus Interface Handbook G68 Package CY7C960 CY7C961 PDF

    Untitled

    Abstract: No abstract text available
    Text: fax id: 5604 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit com parator for slave address decoding


    OCR Scan     		CY7C964 64-pin 68-pin PDF