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    3500S35 Search Results

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    3500S35 Price and Stock

    Orbel Corporation GRVC-3500S3500-0200X

    COVER RF SHIELD GROOVE LOC 3.5
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GRVC-3500S3500-0200X Box 100
    • 1 -
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    • 100 $13.3032
    • 1000 $13.3032
    • 10000 $13.3032
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    Vishay Intertechnologies ACASA3500S3500P500

    ACAS 0612 350R S 350R P5 - Tape and Reel (Alt: ACASA3500S3500P500)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ACASA3500S3500P500 Reel 9 Weeks 5,000
    • 1 -
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    • 100 -
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    • 10000 $0.20226
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    Vishay Intertechnologies ACASA3500S3500P100

    ACAS 0612 350R S 350R P1 - Tape and Reel (Alt: ACASA3500S3500P100)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ACASA3500S3500P100 Reel 9 Weeks 1,000
    • 1 -
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    • 1000 $0.29694
    • 10000 $0.27264
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    Mouser Electronics ACASA3500S3500P100 944
    • 1 $1.39
    • 10 $0.805
    • 100 $0.512
    • 1000 $0.326
    • 10000 $0.326
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    Baumer Electric Ag CFDM 20N3500/S35L

    Sensor: capacitive
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CFDM 20N3500/S35L 1
    • 1 $298.03
    • 10 $282.35
    • 100 $282.35
    • 1000 $282.35
    • 10000 $282.35
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    Baumer Electric Ag CFDM 20P3500/S35L

    Sensor: capacitive
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CFDM 20P3500/S35L 1
    • 1 $298.03
    • 10 $282.35
    • 100 $282.35
    • 1000 $282.35
    • 10000 $282.35
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    Find more 3500S35 price and stock on Findchips.com

    3500S35 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    gf3500s35

    Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		3500S35 D2196 E1269 3500S35 gf3500s35 GF-3500 D2196 GF35 D149 D150 D2240 D257 D792 PDF

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		3500S35 D2196 3500S35 PDF

    bergquist

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		3500S35 D2196 3500S35 bergquist PDF

    GDDR5 pinout

    Abstract: coprocessor
    Text: Intel Xeon Phi Coprocessor Datasheet April 2014 Document ID Number: 328209 003EN By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel


    Original     		003EN GDDR5 pinout coprocessor PDF

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		AN-659-1 FC-BGA T0812012 daewon tray PDF

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		AN-657-1 KS-886H Kostat tray PDF