MRJ21 connector
Abstract: rj21 cable connector MRJ21 RJ21 connector rj21 RJ45 2x6 jack connector stacked low profile rj45 connector DSLAM board layout
Text: Technical Report 503-1022 30Mar07 Rev A MRJ21* Connectors Next Generation I/O Connectors for Improved Packaging Density, Gigabit Ethernet Performance and Installation Time Reduction As the benefits of operating networks at Gigabit Ethernet GbE speed become more evident, it is
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MRJ21*
non-802
RJ45s
EIA568/Category
MRJ21 connector
rj21 cable connector
MRJ21
RJ21 connector
rj21
RJ45 2x6 jack connector
stacked low profile rj45 connector
DSLAM board layout
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4 pin connector power mate
Abstract: 8 pin connector power mate kojiri 20 Pin FPC PCB 1.0 connector
Text: Instruction Sheet 411-78159 30MAR07 Rev. F 取扱説明書 0.4mm Pitch Stacking Connector 1. Scope 1. 適用範囲 This specification covers the Mounting Connector 本規格は 0.4mmピッチ基板対基板コネクタの on the board and handling of 0.4mm pitch Board to
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Fig13)
Fig14)
Fig13
Fig14
4 pin connector power mate
8 pin connector power mate
kojiri
20 Pin FPC PCB 1.0 connector
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CTLB039432-004
Abstract: CTLH986-001
Text: 501-624 Qualification Test Report 17Mar08 Rev B XFP Copper Module Direct Attach Cable Assembly and Cage 1. INTRODUCTION 1.1. Purpose Testing was performed on the Tyco Electronics XFP Copper Module Direct Attach Cable Assembly and Cage to determine its conformance to the requirements of Product Specification 108-2127 Revision B.
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25Aug05
08Dec05.
CTLB039432-004.
30Mar07
13Jul07.
CTLB039432-004
CTLH986-001
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Untitled
Abstract: No abstract text available
Text: SPACE APPLICATIONS ONLY PHR Vishay Sfernice ESCC 4001/023 Qualified High Precision 5 ppm, 0.01 % , High Stability (0.02 %) Thin Film Chip Resistors FEATURES • Load life stability at ± 70 °C for 2000 hours: 0.15 % under Pn • Low temperature coefficient down to ± 10 ppm/°C
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Untitled
Abstract: No abstract text available
Text: Features General • High-performance, Low-power AVR Core Enhanced RISC Architecture • • • • • • – 120 Powerful Instructions Most Executed in a Single Clock Cycle Low Power Idle and Power-down Modes Bond Pad Locations Conforming to ISO 7816-2
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128-byte
6548AS
30Mar07
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Untitled
Abstract: No abstract text available
Text: Crystek Corporation AVAILABLE PERFORMANCE SPECIFICATION Lower Frequency: Upper Frequency: Tuning Voltage: Supply Voltage: Output Power: Supply Current: Harmonic Suppression 2nd Harmonic : Pushing: Pulling, all Phases: Tuning Sensitivity: Phase Noise: @ 10kHz offset:
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10kHz
CVCO55CL-0600-0880
30-Mar-07
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NAME115
Abstract: No abstract text available
Text: i CHANGED BY HONEYWELL PART NUMBER REV E MAKE 11 5 -8 0 2 E D F -8 0 2 F UPDATE TO SHOW NEW HEADER - ECO 14961 9NOVOO G ADD DATE CODE TO STAMP ECO-0029905 30MAR07 CH AN G ES / D R A W IN G PER ECO ECO DATE 9605 015—802EDF—9K1 THERM. B BLACK GLASS INSULATION
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ECO-0029905
30MAR07
015--802EDF--9K1
1APR96
2APR96
NAME115
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