30A06 Search Results

Contextual Info: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit

FCH30A06

Contextual Info: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit

dual common cathode

Contextual Info: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit

FCH30A06

Contextual Info: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit

Dense-Pac Microsystems

Contextual Info: COPIA D P Z 128W 16A 3 Dense-Pac Microsystems. Inc. q 128K X 16 FLASH EEPROM DENSE-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D PZ128W 16A3 "DEN SE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip

ueju

Contextual Info: V V, i -5 l i £7 DPZ256W16A3 SD PM ; Dense-Pac Microsystems, Inc ^ 2S6K X 16 FLASH EEPROM DENSE-STACK M ODULE PRELIMINARY DESCRIPTION: The DPZ256W16A3 “ DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: A fS í *' î c DPMÍ D P Z 1 M W 1 6 A 3 a^nseHPac^Microsyítems, Inc. 0 _1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY D E SC R IP T IO N : The DPZ1MW16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: □PM DPS128X16BH3 Dense-Pac Microsystems. Inc. ^ 128K X 16 CMOS SRAM J-LEADED STACKS ADVANCED INFORMATION DESCRIPTION: The DPS128X16BH3 "S T A C K " m odule is a r e v o lu tio n a ry n e w h ig h sp e e d m e m o ry subsystem using D ense-Pac M icro syste m s'

Contextual Info: I 1 3 1993 APR C d p DPZ512X16A3 m 512K X 16 FLASH EEPRO M DENSE-STACK M O D U LE PRELIM INARY DESCRIPTION: The D PZ512X 16A 3 "DCN SE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable leadless Chip C arriers S L C C mounted on a co-fired ceram ic

30021

Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
Contextual Info: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and

310CB

Abstract: transistor 30945 30945 30A27 k3264 TN1073 30A07 30A45
Contextual Info: ORSPI4 Provisioning September 2004 Technical Note TN1073 Introduction The ORSPI4 is a next generation FPSC targeted at high speed data transmission, built on the Series 4 reconfigurable embedded System-on-Chip SoC architecture. The ORSPI4 device has been designed to support a broad

AL437

Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

L130C

Abstract: L74c l31c l97c l65c A311TC l146c l48c L202C L235C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC May 2009 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

WB4500

Abstract: telecom bus WB1500 OC48 ORSO82G5 ORT8850 RD1018 STS-48C 30A06 8850H
Contextual Info: Telecom Bus Bridge for SONET Cross Connect March 2004 Reference Design RD1018 Introduction The Telecom Bus Interface TBI is an accepted industry standard that is commonly found in SONET/SDH systems. It is a parallel interface used for chip-to-chip communication on SONET line cards. A typical example illustrating the usefulness of the TBI is shown in Figure 1.

3080e equivalent

Contextual Info: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane

Contextual Info: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs January 2004 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s. This device is targeted toward users needing high-speed

L47C

Abstract: L146C L135 l54c L62C L97C verilog code of prbs pattern generator L71C L235C L43C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC February 2005 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

Contextual Info: D P S512S 16U □PM Dense-Pac M icrosystem s. Inc. 512K X 16 CM OS SRAM MODULE O PRELIMINARY D E S C R IP T IO N : T he D P S 5 1 2 S 1 6 U is a 5 12 K X 16 high-density, low-power static R A M m odule com prised of eight 128K X 8 m onolithic SR A M 's, an advanced high-speed

Contextual Info: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane

3013X

Abstract: EQUIVALENT BC 309 3093b
Contextual Info: ORCA ORSO82G5 1.0 - 2.7 Gbps SONET Backplane Interface FPSC October 2002 Preliminary Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted towards users needing high-speed backplane interfaces for SONET and other non-SONET applications. The ORSO82G5 has 8 channels of integrated 1.02.7G SERDES channels with built-in Clock and Data Recovery (CDR), along with more than 400K usable FPGA

DMC CRIMP TOOL CHART

Abstract: DMC CRIMP TOOL calibration CHART M39029/1-101 M39029/22-192 M39012/30-0503 crimping positioners cross reference DMC HX4 crimp tool M39029/22-192 crimp tool MS27493-22D M39029/11-144
Contextual Info: Tooling Guide CD pages 2/11/03 2:56 PM Page 1 Connector Tooling Guide DANIELS MANUFACTURING CORPORATION an ISO9001 Registered Company Tooling Guide CD pages 2/11/03 2:56 PM Page 2 ® DANIELS MANUFACTURING CORPORATION PREFACE & TABLE OF CONTENTS Daniels tools have been utilized in military

Contextual Info: f ip ii# , U f * m DPS256X32WS Dense-Pac Microsystems, Inc. 0 256K x 32 CMQS SRAM w/ Separate 1/0 MODULE D E S C R IP T IO N : P IN -O U T D IA C R A M The D P S2 5 6 X 3 2 W S is a 256K X 32 with separate Input/Output, high density, high-speed Static Random Access M em ory SR AM module, intended for high

Contextual Info: 128 Megabit CMOS DRAM Dense-Pac Microsystems. Inc. ^ DPD16MX8PH4 PRELIMINARY DESCRIPTION: The DPD16MX8PH4 DRAM module is a revo lu tio n ary m em ory system using Dense-Pac M icrosystem s' new 2nd G eneration Stacking Technology. The module combines eight stackable ceramic

Contextual Info: o tt a s 1991 —— DPZ1 MX! 6A3 □ P M o 1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE ADVANCED INFORMATION DESCRIPTION: The D PZ1M X 16A 3 "D EN SE-STA CK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip