30A04M Search Results

Contextual Info: □PM Dense-Pac Microsystems. Inc. <T DPV32X16A 32K X 16 UVEPROM PGA MODULE O PRELIM IN ARY DESCRIPTION: The DPV32X16A is a 40-pin Pin G rid Array PGA consisting o f tw o 32K X 8 UVEPROM devices in ceram ic LCC packages surface m ounted on a co-fired ceram ic substrate w ith m atched thermal coefficients.

64KX16

Contextual Info: □PM DPV64X16A 64K X 16 UVEPROM PGA MODULE Dense-Pac Microsystems. Inc. ^ PRELIMINARY DESCRIPTION: The D P V 6 4 X 1 6 A is a 40-pin Pin Grid Array PGA consisting of two 64K X 8 U V E P R O M devices in ceramic LC C packages surface mounted on a co-fired

Contextual Info: □PM DPE256S8N Dense-Pac Microsystems. Inc. ^ 256K X 8 CMOS EEPROM MODULE PRELIMINARY D ESC R IP T IO N : The D PE256S8N is a 256K X 8 high-density, low-power EEPROM module comprised of two ceramic 128K X 8 m onolithic EE P R O M 's, an ad vanced high-speed

Contextual Info: DPS1037 Dense-Pac Microsystems, Inc. 64K X 16 CMOS SRAM MODULE O DESCRIPTION: The DPS1037 is a 64K X 16 high-speed, low-power static RAM module comprised of sixteen 64K X 1 monolithic SRAM's, and decoupling capacitors surface mounted on a co-fired ceramic substrate having

Dense-Pac Microsystems

Abstract: 0512k
Contextual Info: □PM Dense-Pac Microsystems, Inc. DPE512S8N 512K X 8 CMOS EEPROM MODULE O PRELIMINARY DESCRIPTION: The DPE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 m o no lithic EEP R O M 's, an advanced high-speed C M O S decoder and decoupling capacitors surface

40-pin EPROM pinout

Contextual Info: DENSE-PAC MICROSYSTEMS CDPM 2ÔE D Dense-Pac Microsystems, Inc. • 575^415 OGOQ^Sa 5 WËVPC DPV128X16A ^ H IG H SPEED 128K X 16 U V EP R O M PG A M O D U LE PRELIMINARY DESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPRO M devices in