30A04 Search Results

vdr 275

Contextual Info: 512Kx16/256Kx32, 20 - 45ns, PGA 30A044-03 F 8 Megabit High Speed CMOS SRAM DPS256X32CV3/DPS256X32BV3 DESCRIPTION: The DPS256X32CV3/DPS256X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted

Contextual Info: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04

30A04

Abstract: FCH30A0
Contextual Info: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04

FCH30A04

Contextual Info: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04

FCH30A04

Contextual Info: SBD T y p e : FCH30 FCH30A0 30A04 A04 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A04

30021

Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
Contextual Info: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS EEPROM DPE512S8N DESCRIPTION: The DPE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM's, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate

Contextual Info: DPS128X32AV3 HIG H SPEED 128K X 32 CMOS SRAM VERSA-STACK ADVANCED INFORMATION DESCRIPTION: The DPS128X32AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired

Contextual Info: ^ f= ¡| j¡ñ ¡P > 'v.:. U DPS256X32AV3 ^ l v l Dense-Pac Microsystems, In c ^ y _ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK w ADVANCED INFORMATION DESCRIPTION: The D PS2 5 6 X3 2 A V 3 "V E R SA -ST A C K " module is a revolutionary new high speed memory subsystem

Contextual Info: D P V 128X 16A H IG H S PEED 1 2 8 K X 16 U V E P R O M P G A M O D U L E PRELIM IN ARY D ESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PG A consisting of two 128K X 8 U V EP R O M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPS128X24V3 Dense-Pac Microsystems, Inc. CERAMIC 128K X 24 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: T he D P S 1 2 8 X 2 4 V 3 " V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless

Contextual Info: Dense-Pac Microsystems, Inc. ^ D P S 1 2 8 X 1 6 A 3 CERAM IC 128K X ¡ 6 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256C32BV3 DESCRIPTION: The DPS256C32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

DPS128X32BV3

Abstract: DPS128X32CV3
Contextual Info: 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC

DPS128C32BV3

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic

cdr 03a

Abstract: PESTO MCC 90-15 Dense-Pac Microsystems T-46-23-74 836 mgc
Contextual Info: DENSE-PAC MICROSYSTEMS 2ÖE J> • 275=1415 ODGG7ÖO 2 « D P C DPS1MS8A3 Dense-Pac M k ro iy siem s jn c ^ 1024 |<X 8 BUFFERED/DECODED C M O S SRAM M O D ULE PRELIM IN A RY_ 7^V4-23-W D ESCRIPTIO N: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory

DPS128X32CV3

Abstract: 2CV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ

OL80m

Abstract: DPS128X32BV3 DPS128X32CV3
Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC

AL437

Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: Dense-Pac Microsystems, Inc. ¿-D PS1 28X24AV3 HIG H SPEED 128K X 24 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPST28X24AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry n e w high speed m em o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

DPS128X16A

Contextual Info: CERAMIC 128KX 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a re vo lu tio n ary n ew m e m o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC m ounted on a co-fired ceram ic substrate. The module packs