28P2V Search Results

14AD

Abstract: 28P2V SOP28 package SOP28-P-375-1 MS-013-AE
Contextual Info: 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight g 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

sharp lsi pc 2002

Abstract: AXS628319C P28GM-50-450A1-2 FRAME32
Contextual Info: AXS6 SOP SOCKETS AXS6 µSOCKET SERIES IC SOCKETS FOR SMALL OUTLINE PACKAGE 3. Space saving The socket occupies an area only 1.25 times the size of the IC. High density mounting is possible even if the socket is used. 4. Automated mounting compatible The socket has an open flat construction

tgn 600

Contextual Info: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact

Contextual Info: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5

94v-0 m02

Abstract: ATMEL 32P
Contextual Info: SOCKETS SOP — 32 D XX — SMT — TT n Position:. 32 D = .525" Row Spacing Plating Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ^005371 00003bfl D HGb PC board pattern j j P S ' ± 0.3 General Tolerance ALL DIMENSIONS

Robinson Nugent IC SOCKET

Contextual Info: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5

M66503AFP

Abstract: 6503A M66503ASP/FP
Contextual Info: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION PIN CONFIGURATION (TOP VIEW) T h e M 6 6 5 0 3 A is a c o n s ta n t c u rre n t LED d riv e r IC, w h o se o u tp u t c u rre n t is v aria ble. T h e IC 's fu n c tio n s in clu d e 16-bit

M66503ASP/FP

Contextual Info: MITSUBISHI DIGITAL ASSP M66503ASP/FP 16-BIT CONSTANT CURRENT LED DRIVER with SHIFT REGISTER AND LATCH DESCRIPTION The M66503A is a constant current LED driver IC, whose output current is variable. The IC’s functions include 16-bit serial input/parallel output shift register with output latch.

P20GT-50-375B-2

Abstract: 945080
Contextual Info: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC

TSOP 48 thermal resistance

Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

Robinson Nugent s2

Contextual Info: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact

ATMEL 32P

Abstract: toshiba 94V-0
Contextual Info: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d

M66805P

Abstract: M66806FP
Contextual Info: HIGH-SPEED LINE INTERFACE 1C SEM CONDUCTOR New s FUNCTION OF 2 CONVENTIONAL INTERFACE ICS HOUSED IN A SINGLE PACKAGE D E S C R I P T I function of 2 traditional line interfaces housed in a single package. The M66805P has 4 built-in circuits connecting RS-422A line drivers/re­

M66S

Abstract: n type laser diode M66311P 16P2N-A 16P2N 32P2W n type laser diode driver
Contextual Info: IA P P LIC A T IO N SPECIFIC IC Function Type No. Package M irai fiate ftamj M66235FP 16P2N-A M66236FP 16P2N-A Synchronous clock generator Includes PLL frequency synthesizer Features U sage/Field • Wide frequency range 25~52MHz • Efficient synchronous accurity ± 3ns

P20GT-50-375B-2

Contextual Info: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension