286MM2 Search Results

Contextual Info: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations

W3E2M64S-XSBX

Contextual Info: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E2M64S-XSBX is a member if WEDC’s high density/high preformance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features

TSOP 66 Package

Abstract: W3E32M64S-XSBX
Contextual Info: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E32M64S-XSBX is a member of WEDC’s high density/high performance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features

Contextual Info: 8M x 32 32MB Flash Optimum Density and Performance in One Package W78M32V-XBX* Features The W78M32V-XBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).

Contextual Info: 8M x 64 64MB Flash Optimum Density and Performance in One Package W78M64V-XSBX* Features The W78M64V-XSBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).

Sn63pB37 tds

Abstract: W3E32M64S-XSBX TSOP66
Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333* „ Package: BENEFITS „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)

Contextual Info: TECHNICAL ARTICLE | Join | Tweet Connect Maximizing Performance and Integration in Applications Requiring Isolated SPI by Mark Cantrell and Bikiran Goswami, Analog Devices, Inc. Real-World SPI Implementation SPI is a very useful and flexible standard, but its flexibility stems from its

Contextual Info: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count  2.5V ±0.2V core power supply

Contextual Info: W3E32M64S-XB3X 256 – 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count

Contextual Info: White Electronic Designs W332M64V-XSBX ADVANCED* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing

Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)

Contextual Info: White Electronic Designs W332M64V-XSBX PRELIMINARY* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing

Contextual Info: W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION  High Frequency = 100, 125, 133MHz The 256MByte 2Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM with

VCCQ15

Contextual Info: W3E32M64S-XSBX 32Mx64 DDR SDRAM Advanced* FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266 „ Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK)

Contextual Info: White Electronic Designs W3E32M64S-XSBX PRELIMINARY* 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% SPACE SAVINGS vs. TSOP Package: • 43% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count

Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply

W332M64V-XSBX

Contextual Info: White Electronic Designs W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing

TSOP RECEIVER

Abstract: W3E32M64S-XSBX Theta JC of FBGA
Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „ Differential clock inputs (CK and CK#)

Contextual Info: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333*, 400* „ Package: BENEFITS „ • 208 Plastic Ball Grid Array PBGA , 13 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible) „

Contextual Info: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E32M64S-XSBX is a member if WEDC’s high density/high preformance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features