DS13
Abstract: MC804256K32L-15
Text: 256K32, MC804256K36 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 100 Pin LQFP 20 mm x 14 mm body 0.65 mm nominal pin pitch 80 79 78 77 76 75 74 73 72 71 70
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MC804256K32,
MC804256K36
DS13
MC804256K32L-15
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MoSys
Abstract: No abstract text available
Text: 256K32, MC803256K36 256Kx32/36 Pipeline Burst RAM MOSYS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 100 Pin PQFP 20 mm x 14 mm body 0.65 mm nominal pin pitch 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63
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MC803256K32,
MC803256K36
256Kx32/36
133-166MHz
100-Pin
MoSys
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TXD70
Abstract: RMII PHY MTD508
Text: MYSON TECHNOLOGY MTD508 Preliminary 8 Port 10M/100M Ethernet Switch FEATURES GENERAL DESCRIPTION • IEEE802.3 and IEEE802.3u compliant. • Provide 8 RMII (Reduced Media Independent Interface) ports. • Programmable 1K/8K MAC addresses filtering. • Store and forward switching function and bad
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MTD508
10M/100M
IEEE802
pressure/802
75MHz
MTD508
TXD70
RMII PHY
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O28 Package
Abstract: WS256K32-XXX a16 power
Text: 256K32-XXX 256Kx32 SRAM MODULE PRELIMINARY* FEATURES • ■ ■ ■ ■ Access Times 20, 25, 35nS ■ MIL-STD-883 Compliant Devices Available ■ Packaging • 66 pin, PGA Type, 1.185 inch square, Hermetic Ceramic HIP Package 401 ■ TTL Compatible Inputs and Outputs
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WS256K32-XXX
256Kx32
MIL-STD-883
WS256K32-XHX
WS256K32-XG4X
256Kx32,
512Kx16
512Kx32
256K32
O28 Package
WS256K32-XXX
a16 power
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En1522
Abstract: RMII12 "filtering database" RMII PHY uplink DMA13 MTD516 REG14 RXD11 RMII Specification revision 1.2
Text: MYSON TECHNOLOGY MTD516 Preliminary 16 Port 10M/100M Ethernet Switch FEATURES GENERAL DESCRIPTION • IEEE802.3 and IEEE802.3u compliant. • Provide 16 RMII (Reduced Media Independent Interface) ports. • Programmable 1K/8K MAC addresses filtering database.
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MTD516
10M/100M
IEEE802
pressure/802
83MHz
MTD516
En1522
RMII12
"filtering database"
RMII PHY
uplink
DMA13
REG14
RXD11
RMII Specification revision 1.2
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lg crt monitor circuit diagram
Abstract: hs 8109 DS-17 SANYO 486dx isa bios pin assignment SP1137 hitachi plasma electronic diagram sharp lm64p DS-18 SANYO Spectrol 157 74 VGA 20 PIN LCD MONITOR CABLE CONNECTION DIAGRAM
Text: SPC8110 LOCAL BUS LCD/CRT VGA CONTROLLER Technical Manual Issue Date: 04/01/97 Document Office No. X07-GQ-001-01 Copyright 1997 S-MOS Systems Inc. All rights reserved. VDC This document, and any text derived, extracted or transmitted from it, is the sole property of S-MOS Systems Inc. and may not be used, copied,
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SPC8110
X07-GQ-001-01
LM334
X07-GG-002-01
lg crt monitor circuit diagram
hs 8109
DS-17 SANYO
486dx isa bios pin assignment
SP1137
hitachi plasma electronic diagram
sharp lm64p
DS-18 SANYO
Spectrol 157 74
VGA 20 PIN LCD MONITOR CABLE CONNECTION DIAGRAM
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WS256K32-XXX
Abstract: 44256K
Text: 256K32-XXX HI-RELIABILITY PRODUCT 256Kx32 SRAM MODULE PRELIMINARY* FEATURES • 2V Data Retention devices available 256K32L-XXX low power version only ■ Access Times 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging ■ Commercial, Industrial and Military Temperature Range
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WS256K32-XXX
256Kx32
WS256K32L-XXX
MIL-STD-883
WS256K32N-XHX
WS256K32-XG4X
256Kx32,
512Kx16
512Kx32
WS256K32-XXX
44256K
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H3084
Abstract: RMII PHY MTD505 h1838
Text: MYSON TECHNOLOGY MTD505 Preliminary 5 Port 10M/100M Ethernet Switch FEATURES GENERAL DESCRIPTION • • • • The MTD505 complies fully with the IEEE802.3, 802.3u and 802.3x specifications and is a non-blocking 5 port 10M/100M Ethernet switch device.
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MTD505
10M/100M
MTD505
IEEE802
MTD505,
H3084
RMII PHY
h1838
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SECAM Encoders
Abstract: I2S* sony Dolby prologic II SP8890 SP8890C iso 13818-2 transport stream BT 151 PIN DIAGRAM PAL to ITU-R BT.601/656 Decoder LMD31 prologic II 5.1
Text: Datasheet SP8890C V02.01 Final 2000 SPaSE bv SP8890C Datasheet - Revision History Revision History Version 00.98 01.00 02.00 02.01 Date 27/02/1998 13/08/1998 07/09/1999 22/11/2000 Changes Pinning, data input, memory requirements, 2 Mbyte modes. Memory Requirements.
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SP8890C
NL009830303B01
SECAM Encoders
I2S* sony
Dolby prologic II
SP8890
SP8890C
iso 13818-2 transport stream
BT 151 PIN DIAGRAM
PAL to ITU-R BT.601/656 Decoder
LMD31
prologic II 5.1
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY 256K32D4 S MT41 256K32D4(S) 256K x 32 SGRAM [U II^ P n M I TECHNOLOGY, INC. 256K x 32 SGRAM SYNCHRONOUS GRAPHICS RAM PULSED RAS#, DUAL BANK, PIPELINED, 3.3V OPERATION FEATURES PIN ASSIGNMENT (TOP VIEW) • Fully synchronous; all signals registered on positive
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256K32D4
LC256K32D4
024-cycle
0015L77
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8823* toshiba
Abstract: TL5564
Text: Integrated C ircuits Incorporated 10301 W illows Road IK ill = a * C M O S 32X 8-01 — 256K32 768W S0TRDT,X C8RB,T integrated circuits incorporated FEATURES: • Very low power dissipation ■ Single 5V power supply ■ Data retention to 2.0V VDC ■ Fully static operation
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256K32
32X8-01
8823* toshiba
TL5564
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXX WHITE MICROELECTRONICS 256Kx32SRAM MODULE P R E L IM IN A R Y * FEATURES • Access Times 20, 25, 35ns 2 V D a ta Retention devices available ■ MIL-STD-883 Compliant Devices Available Commercial, Industrial and M ilitary Temperature Range
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WS256K32-XXX
256Kx32SRAM
MIL-STD-883
256Kx32,
512Kx16
512Kx32
WS256K32N-XHX
WS256K32-XG4X
256K32
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXC M/HITE /MICROELECTRONICS 256Kx32 SRAM MODULE ADVANCED* FEATURES • Access T im e s * ■ C o m m e rc ia l T e m p e ra tu re R ange B iC M O S : 10ns ■ TTL C o m p a tib le In puts and O u tp u ts ■ 5 V o lt P o w e r S u p p ly ■
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WPS256K32-XXC
256Kx32
256K32
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MT41LC256K32D4
Abstract: No abstract text available
Text: PR EL IM IN AR Y MICRON I 256K32D4 S 2 56K x 32 S G R A M TECHNOLOGY, INC. SYNCHRONOUS G R A P H I C S RAM 256K x 32 S G R A M PULSED RAS#, DUAL BANK, PIPELINED, 3.3V OPERATION FEATURES * Fully synchronous; all signals registered on positive edge of system clock
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MT41LC256K32D4
024-cycle
100-Pin
MT41LC2
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Untitled
Abstract: No abstract text available
Text: a 256K32-XPJX WHITE /MICROELECTRONICS 256Kx32SRAM MODULE ADVANCE * FEATURES • Access Tim es ■ Commercial and Industrial Tem perature Ranges BiCMOS: 12, 15ns ■ TTLC o m p atib le Inputs and CM OS Outputs CMOS: 1 7 ,2 0 ,2 5 n s ■ I/O Com patible w ith 3.3V Devices
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WPS256K32-XPJX
256Kx32SRAM
256Kx32,
512Kx16
12Kx32
WPS256K32-XPJX
256K32
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXX WHITE /MICROELECTRONICS 256Kx32SRAM MODULE PRELIMINARY* FEATURES • A ccess Tim es 20, 25, 35ns ■ 2V D ata R etention devices a va ila b le ■ M IL-S TD -883 C om pliant Devices A v a ila b le ■ C om m ercial, Ind ustria l and M ilita r y Tem pe ratu re Range
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WS256K32-XXX
256Kx32SRAM
S256K
S256K32-XG
256Kx32,
512Kx16
512Kx32
256K32
256Kx32
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Untitled
Abstract: No abstract text available
Text: 256K32-XG2TXE •lì Hi-R£LiASIÜTY PRODUCT 256Kx32 EEPROM MODULE * PRELIMINARY FEATURES ■ A c c e s s Tim e s o f 150, 200, 250, 300ns Page W rite C ycle Tim e: 10m s M ax ■ Packaging: Data Polling for End of W rite Detection • 68 lead, Herm etic CQFP G2T , 22.4m m (0.880”) square,
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WE256K32-XG2TXE
256Kx32
300ns
256Kx32.
256K32
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXC M/HITE /MICROELECTRONICS 256Kx32 SRAM MODULE ADVANCED* FEATURES • A cce ss Tim es BiCMOS: 10ns CM OS: 1 2 ,1 5 , 20ns ■ C om m ercial T e m p e ra tu re Range ■ Packaging ■ L ow Power • M o d u le is m a n u fa c tu re d w it h e ig h t 256Kx4 S R AM m em ory
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WPS256K32-XXC
256Kx32
256Kx4
256K32
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXC M/HITE MICROELECTRONICS 256Kx32 SRAM MODULE ADVANCED* FEATURES • A cce ss Tim es BiCMOS: 10, 12ns CMOS: 15, 20ns ■ C om m ercial Te m p e ra tu re Range ■ Packaging ■ L ow P ower • M o d u le is m a n u fa c tu re d w it h e ig h t 2 56Kx4 SR AM m em ory
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WPS256K32-XXC
256Kx32
56Kx4
256Kx32
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXX WHITE /M ICROELECTRONICS 256Kx32 SRAM MODULE PRELIMINARY* FEATURES • A cce ss Tim es 20, 25, 35nS ■ 2V Data R etention devices a vailable ■ M IL-S TD -883 C o m p lia n t Devices A v a ila b le ■ C om m ercial, Industrial and M i lita r y T e m p e ra tu re Range
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OCR Scan
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WS256K32-XXX
256Kx32
256K32
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Untitled
Abstract: No abstract text available
Text: 256K32-XXX M/HITE /MICROELECTRONICS 256Kx32 SRAM MODULE PRELIMINARY* FEATURES • A c c e s s T i m e s 20, 25, 3 5 n s ■ 2 V D a ta R e te n tio n d e v i c e s a v a il a b le ■ M IL - S T D - 8 8 3 C o m p l i a n t D e v ic e s A v a i la b le ■
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WS256K32-XXX
256Kx32
256K32
256KX32
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AO-17
Abstract: No abstract text available
Text: TT 256K32-XXX WHITE /MICROELECTRONICS 256Kx32 SRAM MODULE PRELIMINARY* FEATURES • A ccess Tim es 20, 25, 35nS 2V Data Retention devices availab le ■ MIL-STD-883 Com pliant D evices A vailable Com m ercial, Industrial and M ilitary Tem perature Range
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OCR Scan
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WS256K32-XXX
256Kx32
MIL-STD-883
S256K32-XH
S256K32-XG
256Kx32,
512Kx16
256K32
AO-17
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Untitled
Abstract: No abstract text available
Text: a 256K32-XXC M/HITE MICROELECTRONICS 256Kx32 SRAM MODULE ADVANCED* FEATURES • ■ Access T im e s * ■ C o m m e r c ia l T e m p e r a t u r e R ange B iC M O S : 1 0ns ■ TTL C o m p a t i b l e In p u ts a n d O u tp u t s CM OS: 1 2 ,1 5 , 20, 35ns
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WPS256K32-XXC
256Kx32
256KX32
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Untitled
Abstract: No abstract text available
Text: ca 256K32-XXX WHITE /M IC RO ELEC TR O N IC S 256Kx32 SRAM MODULE prelim inary * FEATURES • Access Times 20, 25, 35ns ■ 2V Data Retention devices available ■ MIL-STD-883 Compliant Devices Available ■ Commercial, Industrial and Military Temperature Range
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OCR Scan
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WS256K32-XXX
256Kx32
MIL-STD-883
WS256K32N-XHX
WS256K32-XG4X
256Kx32,
512Kx16
512Kx32
256K32
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