23JUN2003 Search Results

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. DIST R E VIS IO N S CM 00 LTR DESCRIPTION R1 SOLDERABILITY SPECIFICATION DWN APVD 08AUG07 KW DC 1 . PARTS '2\ CONTACT IS PLATED OVERALL WITH 0 . 0 0 1 2 7 [ .0 0 0 0 5 0 ] NICKEL, THEN

M50FLW040A

Abstract: M50FLW040B PLCC32 TSOP32
Contextual Info: M50FLW040A M50FLW040B 4 Mbit 5 x 64KByte Blocks + 3 x 16 x 4KByte Sectors 3V Supply Firmware Hub / Low Pin Count Flash Memory PRELIMINARY DATA FEATURES SUMMARY • ■ ■ ■ ■ ■ ■ FLASH MEMORY – Compatible with either the LPC interface or the FWH interface (Intel Spec rev1.1)

M50FLW040A

Abstract: M50FLW040B PLCC32 TSOP32 A19-21
Contextual Info: M50FLW040A M50FLW040B 4 Mbit 5 x 64KByte Blocks + 3 x 16 x 4KByte Sectors 3V Supply Firmware Hub / Low Pin Count Flash Memory PRELIMINARY DATA FEATURES SUMMARY • ■ ■ ■ ■ ■ ■ FLASH MEMORY – Compatible with either the LPC interface or the FWH interface (Intel Spec rev1.1)

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. DIST CM 00 By - R E VIS IO N S LTR DESCRIPTION R2 1 . A PARTS COMPLY TO AMP REVISED PER 11 MAR 11 ECO-11-004587 SOLDERABILITY SPECIFICATION DWN DATE APVD

A0-A21

Abstract: J-STD-020B M30W0R6500T0 LFBGA88 AI08599
Contextual Info: M30W0R6500T0 96 Mbit 64 + 32Mb, x16, Multiple Bank, Burst, Flash Memories 1.8V Supply, Multi-Chip Package FEATURES SUMMARY • ■ ■ ■ ■ MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 32 Mbit (2Mb x 16) Flash Memory SUPPLY VOLTAGE

On semiconductor date Code

Abstract: NL17W NL17SZ74US NL27WZ00US NL27WZ02US NL27WZ08US TS16949 NLAS323US "On semiconductor" date Code NL27WZ32US
Contextual Info: FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 23-JUN-2003 SUBJECT: ON Semiconductor Final Product/Process Change Notification #12505 TITLE: Qualification of Additional Assembly/Test Site for ON Semiconductor US8 PACKAGE, Used for Minigate Devices

PPLC32

Contextual Info: M50FLW040A M50FLW040B 4 Mbit 5 x 64KByte Blocks + 3 x 16 x 4KByte Sectors 3V Supply Firmware Hub / Low Pin Count Flash Memory PRELIMINARY DATA FEATURES SUMMARY • FLASH MEMORY ■ – Compatible with either LPC interface or FWH interface (Intel Spec rev1.1) used in PC BIOS

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. By - REVISIONS D IS T CM 00 LTR DESCRIPTION N1 1 PARTS . COMPLY WITH AMP REVISED PER DATE APVD RK HMR 11 MAR 11 EC O -1 1-00491 7 SOLDERABILITY SPECIFICATION

M50FLW040A

Abstract: M50FLW040B PLCC32 TSOP32
Contextual Info: M50FLW040A M50FLW040B 4-Mbit 5 x 64 Kbyte blocks + 3 × 16 × 4 Kbyte sectors 3-V supply Firmware Hub / low-pin count Flash memory Feature summary • ■ ■ ■ ■ Flash memory – Compatible with either the LPC interface or the FWH interface (Intel Spec rev1.1) used

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONIC5 CORPORATION. LOC ALL RIGHTS RESERVED. DIST REVISIONS CM 00 LTR N 1. DWN APVD 23JUN03 SC SR 10 9 - 1 1 - 5 , CONTACT IS PLATED OVERALL WITH 0 .0 0 1 2 7 MIN NICKEL, THEN 0.00 076 GOLD OVER CONTACT LENGTH INDICATED AND

Contextual Info: M50FLW040A M50FLW040B 4 Mbit 5 x 64KByte Blocks + 3 x 16 x 4KByte Sectors 3V Supply Firmware Hub / Low Pin Count Flash Memory FEATURES SUMMARY • FLASH MEMORY Figure 1. Packages – ■ Compatible with either the LPC interface or the FWH interface (Intel Spec rev1.1)