Untitled
Abstract: No abstract text available
Text: PI2DDR3212 1.35V/ 1.5V/1.8V 14 bit 2:1 DDR3/DDR4 Switch Features Description ÎÎ14 bit 2:1 switch that supports DDR3 800 2133Mbps, DDR4 This 14-bit DDR3/DDR4 switch is designed for 1.35V/ 1.5V/ 1.8V supply voltage, POD_12, SSTL_135, SSTL_15 or SSTL_18 signaling and CMOS select input signals. It is designed for
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PI2DDR3212
2133Mbps,
14-bit
2133Mbps
PI2DDR3212
14-bit
MO-220
52-Pin,
PD-2102
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E1751E20
Abstract: EDJ2108DEBG ELPIDA DDR3 2G DDR3 2G 1866 elpida EDJ2108DEBG-MQ DDR3-2133L
Text: PRELIMINARY DATA SHEET 2G bits DDR3 SDRAM EDJ2108DEBG-MQ 256M words 8 bits, 2133Mbps EDJ2116DEBG-MQ (128M words 16 bits, 2133Mbps) EDJ2108DEBG-JQ (256M words 8 bits, 1866Mbps) EDJ2116DEBG-JQ (128M words 16 bits, 1866Mbps) Specifications Features
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EDJ2108DEBG-MQ
2133Mbps)
EDJ2116DEBG-MQ
EDJ2108DEBG-JQ
1866Mbps)
EDJ2116DEBG-JQ
EDJ2108DEBG)
EDJ2116DEBG)
E1751E20
EDJ2108DEBG
ELPIDA DDR3 2G
DDR3 2G 1866 elpida
EDJ2108DEBG-MQ
DDR3-2133L
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Untitled
Abstract: No abstract text available
Text: PI2DDR3212 1.35V/ 1.5V/1.8V 14 bit 2:1 DDR3/DDR4 Switch Features Description ÎÎ14 bit 2:1 switch that supports DDR3 800 2133Mbps, DDR4 This 14-bit DDR3/DDR4 switch is designed for 1.35V/ 1.5V/ 1.8V supply voltage, POD_12, SSTL_135, SSTL_15 or SSTL_18 signaling and CMOS select input signals. It is designed for
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PI2DDR3212
2133Mbps,
14-bit
2133Mbps
PI2DDR3212
14-bit
MO-220
52-Pin,
PD-2102
PI2DDR3212ZLE
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NT5CB64M16DP
Abstract: nt5cb64m16 DDR3-2133-CL13 DDR3 pin out NT5CB64M16D NT5CB64m
Text: NT5CB128M8DN/NT5CB64M16DP NT5CC128M8DN/NT5CC64M16DP 1Gb DDR3 D-die SDRAM Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EI* -FK* DDR3/L-1066-CL7 (DDR3/L-1333-CL8) (DDR3/L-1600-CL10) (DDR3-1866-CL11) (DDR3-2133-CL13) Units
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NT5CB128M8DN/NT5CB64M16DP
NT5CC128M8DN/NT5CC64M16DP
DDR3/L-1066-CL7)
DDR3/L-1333-CL8)
DDR3/L-1600-CL10)
DDR3-1866-CL11)
NT5CB64M16DP
nt5cb64m16
DDR3-2133-CL13
DDR3 pin out
NT5CB64M16D
NT5CB64m
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Untitled
Abstract: No abstract text available
Text: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ*/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency
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NT5CB256M8FN/NT5CB128M16FP
NT5CC256M8FN/NT5CC128M16FP
DDR3-1866
DDR3-2133
x8/78
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K4B2G1646C-HCH9
Abstract: K4B2G1646C K4B2G1646C-HCK0 K4B2G1646C-HC K4B2G1646C-HCK 128mx16 ddr3 k4B2G1646 K4B2G16 K4B2G1646C-HCNB DDR3-2133
Text: Rev. 1.11, Nov. 2010 K4B2G1646C 2Gb C-die DDR3 SDRAM Only x16 96FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B2G1646C
96FBGA
K4B2G1646C-HCH9
K4B2G1646C
K4B2G1646C-HCK0
K4B2G1646C-HC
K4B2G1646C-HCK
128mx16 ddr3
k4B2G1646
K4B2G16
K4B2G1646C-HCNB
DDR3-2133
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NT5CB128m16FP
Abstract: nt5cb256m8fn NT5CB128M16FP-DI NT5CB128M16FP-EK NT5CC128M16FP-DI NT5CC256M8FN-DI NT5CC128M16FP NT5CC256M8FN-DII NT5CB256M8FN-FL NT5CB256M8F
Text: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Feature Programmable Burst Length: 4, 8 8n-bit prefetch architecture Output Driver Impedance Control Backward compatible to VDD= VDDQ= 1.5V Differential bidirectional data strobe
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NT5CB256M8FN
NT5CB128M16FP
NT5CC256M8FN
NT5CC128M16FP
x8/78
NT5CB128M16FP-DI
NT5CB128M16FP-EK
NT5CC128M16FP-DI
NT5CC256M8FN-DI
NT5CC128M16FP
NT5CC256M8FN-DII
NT5CB256M8FN-FL
NT5CB256M8F
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K4W2G1646E-BC11
Abstract: K4W2G1646E-BC1A k4w2g1646 K4W2G1646E
Text: Rev. 1.01, Aug. 2012 K4W2G1646E 2Gb gDDR3 SDRAM E-die 96FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4W2G1646E
96FBGA
K4W2G1646E-BC11
K4W2G1646E-BC1A
k4w2g1646
K4W2G1646E
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2310 dhi
Abstract: NT5CB64M16DP nt5cb64m16 NT5CB128 DDR3 pin out NT5CB64M16D NT5CB128M8DN-CF NT5CB64M16dpcf CL-14
Text: 1Gb DDR3 SDRAM NT5CB128M8DN / NT5CB64M16DP NT5CC128M8DN / NT5CC64M16DP Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EJ* -FK* DDR3/L-1066 DDR3/L-1333 DDR3/L-1600 DDR3-1866 DDR3-2133 CL7 CL8 CL10 CL12 CL13 Units Min. Max.
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NT5CB128M8DN
NT5CB64M16DP
NT5CC128M8DN
NT5CC64M16DP
DDR3/L-1066
1600Mbps.
1600Mbps
DDR3-1866
DDR3-1866
2310 dhi
nt5cb64m16
NT5CB128
DDR3 pin out
NT5CB64M16D
NT5CB128M8DN-CF
NT5CB64M16dpcf
CL-14
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NT5CB128M16FP
Abstract: NT5CB128M16FP-DI NT5CC128M16FP-DI NT5CB128M NT5CB128M16FP-DII NT5CC256M8FN
Text: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency
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NT5CB256M8FN/NT5CB128M16FP
NT5CC256M8FN/NT5CC128M16FP
DDR3-1866
DDR3-2133
155es
x8/78
NT5CB128M16FP
NT5CB128M16FP-DI
NT5CC128M16FP-DI
NT5CB128M
NT5CB128M16FP-DII
NT5CC256M8FN
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GDDR5
Abstract: 96FBGA POD-15 SSTL-15 96-FBGA 170FBGA GDDR3 SDRAM 256Mb 170-FBGA 100-FBGA 136FBGA
Text: Jul.2010 Graphics Code Information Component K4XXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory K 11. "─“ 2. DRAM : 4 12. Package - gDDR2 H : 84FBGA (Halogen Free & Lead Free) B : 84FBGA (Halogen Free & Lead Free & Flip Chip)
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84FBGA
100FBGA
96FBGA
136FBGA
170FBGA
8K/64ms
8K/32ms
GDDR5
96FBGA
POD-15
SSTL-15
96-FBGA
170FBGA
GDDR3 SDRAM 256Mb
170-FBGA
100-FBGA
136FBGA
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k4g10325fe-hc04
Abstract: samsung gddr5 GDDR5 K4G10325FE K4W2G1646C K4G20325FC k4w2g1646 POD-15 K4W1G1646E gddr5 samsung
Text: Jul. 2010 Graphic Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
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K4W2G1646C
HC1A/11
HC7A/08
A/12/14
16Mx32
128Mx16
K4J52324KI
96ball
512Mb
136ball
k4g10325fe-hc04
samsung gddr5
GDDR5
K4G10325FE
K4W2G1646C
K4G20325FC
k4w2g1646
POD-15
K4W1G1646E
gddr5 samsung
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K4B1G1646G-BCK0
Abstract: K4B1G1646G-BCH9 K4B1G1646G-BCF8 K4B1G1646G K4B1G1646G-BCNB k4b1g1646g-bch K4B1G1646GBCH9 K4B1G1646G-BCMA K4B1G1646G-BCF DDR3-2133
Text: Rev. 1.11, Jun. 2011 K4B1G1646G 1Gb G-die DDR3 SDRAM x16 only 96FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B1G1646G
96FBGA
K4B1G1646G-BCK0
K4B1G1646G-BCH9
K4B1G1646G-BCF8
K4B1G1646G
K4B1G1646G-BCNB
k4b1g1646g-bch
K4B1G1646GBCH9
K4B1G1646G-BCMA
K4B1G1646G-BCF
DDR3-2133
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K4W1G1646G-BC11
Abstract: K4W1G1646G-BC12 470 AP 02
Text: Rev. 1.0, Nov. 2010 K4W1G1646G 1Gb G-die gDDR3 SDRAM 96 FBGA with Lead-Free & Halogen-Free RoHS Compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4W1G1646G
K4W1G1646G-BC11
K4W1G1646G-BC12
470 AP 02
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Untitled
Abstract: No abstract text available
Text: COVER DATA SHEET 2G bits DDR3 SDRAM EDJ2108DEBG 256M words x 8 bits EDJ2116DEBG (128M words × 16 bits) Specifications Features • Density: 2G bits • Organization — 32M words × 8 bits × 8 banks (EDJ2108DEBG) — 16M words × 16 bits × 8 banks (EDJ2116DEBG)
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EDJ2108DEBG
EDJ2116DEBG
EDJ2108DEBG)
EDJ2116DEBG)
78-ball
96-ball
M01E1007
E1712E50
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Untitled
Abstract: No abstract text available
Text: Speedster22i DDR Controller User Guide UG031 – April 15, 2013 UG031, April 15, 2013 1 Copyright Info Copyright 2013 Achronix Semiconductor Corporation. All rights reserved. Achronix is a trademark and Speedster is a registered trademark of Achronix Semiconductor Corporation.
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Speedster22i
UG031
UG031,
ddr123
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NT5CB64M16DP
Abstract: nt5cb64m16 NT5CB64M16DP-DH NT5CB128M8DN-CFI NT5CC64M16DP NT5C NT5CC128M8DN DDR3 pin out NT5CB64M16D NT5CB64
Text: NT5CB128M8DN/NT5CB64M16DP NT5CC128M8DN/NT5CC64M16DP 1Gb DDR3 D-die SDRAM Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EJ* -FK* DDR3/L-1066 DDR3/L-1333 DDR3/L-1600 DDR3-1866 DDR3-2133 CL7 CL8
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NT5CB128M8DN/NT5CB64M16DP
NT5CC128M8DN/NT5CC64M16DP
DDR3/L-1066
NT5CB64M16DP
nt5cb64m16
NT5CB64M16DP-DH
NT5CB128M8DN-CFI
NT5CC64M16DP
NT5C
NT5CC128M8DN
DDR3 pin out
NT5CB64M16D
NT5CB64
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K4B1G1646G-BCK0
Abstract: K4B1G1646G-BCH9 K4B1G1646G-BCMA K4B1G1646G-BCN
Text: Rev. 1.11, Jun. 2011 K4B1G1646G 1Gb G-die DDR3 SDRAM x16 only 96FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4B1G1646G
96FBGA
K4B1G1646G-BCK0
K4B1G1646G-BCH9
K4B1G1646G-BCMA
K4B1G1646G-BCN
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NT5CB64M16FP-DH
Abstract: NT5CB64M16FP nt5cb64m16 NT5CB128M8FN-DH NT5CC64M16FP NT5CB128M8FN NT5CB64M1
Text: 1Gb DDR3 F-die SDRAM NT5CB128M8FN/NT5CB64M16FP NT5CC128M8FN/NT5CC64M16FP Preliminary Feature Table 1: CAS Latency Frequency Speed Bins -DH/DHI* -EJ* -FK* DDR3/L-1600 DDR3-1866 DDR3-2133 CL10 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK Avg.
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NT5CB128M8FN/NT5CB64M16FP
NT5CC128M8FN/NT5CC64M16FP
DDR3/L-1600
DDR3-1866
DDR3-2133
NT5CB64M16FP-DH
NT5CB64M16FP
nt5cb64m16
NT5CB128M8FN-DH
NT5CC64M16FP
NT5CB128M8FN
NT5CB64M1
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NT5CB128M16FP-DI
Abstract: NT5CC128M16FP-DI NT5CB128M16FP-DII NT5CB256M8FN-DI NT5CC256M8FN-DI NT5CB128M16FP-EJ NT5CB128M16FP nt5cb128m16 NT5CB128 NT5CC128M-16FP-DI
Text: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ*/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency
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NT5CB256M8FN/NT5CB128M16FP
NT5CC256M8FN/NT5CC128M16FP
DDR3-1866
DDR3-2133
x8/78
NT5CB128M16FP-DI
NT5CC128M16FP-DI
NT5CB128M16FP-DII
NT5CB256M8FN-DI
NT5CC256M8FN-DI
NT5CB128M16FP-EJ
NT5CB128M16FP
nt5cb128m16
NT5CB128
NT5CC128M-16FP-DI
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Untitled
Abstract: No abstract text available
Text: 1Gb DDR3 F-die SDRAM NT5CB128M8FN / NT5CB64M16FP NT5CC128M8FN / NT5CC64M16FP Feature Differential bidirectional data strobe Write Leveling OCD Calibration Backward compatible to VDD= VDDQ= 1.5V Dynamic ODT Rtt_Nom & Rtt_WR ±0.075V
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NT5CB128M8FN
NT5CB64M16FP
NT5CC128M8FN
NT5CC64M16FP
x8/x16
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NT5CC128M16FP-DII
Abstract: No abstract text available
Text: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN / NT5CB128M16FP NT5CC256M8FN / NT5CC128M16FP Feature Programmable Burst Length: 4, 8 8n-bit prefetch architecture Output Driver Impedance Control Backward compatible to VDD= VDDQ= 1.5V Differential bidirectional data strobe
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NT5CB256M8FN
NT5CB128M16FP
NT5CC256M8FN
NT5CC128M16FP
NT5CC128M16FP-DII
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NT5CB128M8FN
Abstract: NT5CB64M16FP-EK NT5CB64M16FP-DH NT5CB64M16FP
Text: 1Gb DDR3 F-die SDRAM NT5CB128M8FN / NT5CB64M16FP NT5CC128M8FN / NT5CC64M16FP Feature 8n-bit prefetch architecture Output Driver Impedance Control Differential bidirectional data strobe Backward compatible to VDD= VDDQ= 1.5V Write Leveling
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NT5CB128M8FN
NT5CB64M16FP
NT5CC128M8FN
NT5CC64M16FP
x8/x16
NT5CB64M16FP-EK
NT5CB64M16FP-DH
NT5CB64M16FP
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EDJ2116DEBG-DJ-F
Abstract: EDJ2116DEBG EDJ2108DEBG-GN-F EDJ2108DEBG DDR3-2133L EDJ2116DEBG-GN-F 2133M
Text: COVER DATA SHEET 2G bits DDR3 SDRAM EDJ2108DEBG 256M words x 8 bits EDJ2116DEBG (128M words × 16 bits) Specifications Features • Density: 2G bits • Organization — 32M words × 8 bits × 8 banks (EDJ2108DEBG) — 16M words × 16 bits × 8 banks (EDJ2116DEBG)
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EDJ2108DEBG
EDJ2116DEBG
EDJ2108DEBG)
EDJ2116DEBG)
78-ball
96-ball
2133Mbps/1866Mbps/1600Mbps/1333Mbps
EDJ2116DEBG-DJ-F
EDJ2116DEBG
EDJ2108DEBG-GN-F
EDJ2108DEBG
DDR3-2133L
EDJ2116DEBG-GN-F
2133M
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