208H Search Results

208H

Contextual Info: 1. Dimensions: 2. Schematic: o- o- 3. Electrical Specs: X o OCL: 3 9 0 u H ± 2 0 % a dlt m @1KHz, 0.1V OADC OCL: 2 1 1 .6 u H ± 2 0 % ca rv DC Res.: 0 .1 0 8 @1KHz, 0.1V, 3.5Adc Ohm s Max N otesi 1. Solderabllltyi Leads shall meet MIL-STD-202G. Method 208H fo r soWerabillty,

208H

Contextual Info: 2. 1. Dimensions: Schematic: o- o- X 3. Electrical Specs: OCL: 1 5 0u H + 10 % 1K H z, 0.1V OADC OCL: 7 7 .3 u H ± 1 0% @1KHz, 0.1V, 4.3ADC DC Res.: 0 .0 4 9 Ohm s Max o lb. dll a ai i/i Notes: 1, Solderablllty: Leads shall meet MIL-STD-202G, Method 208H fo r solderablllty,

208H

Contextual Info: 2. M e c h a n ic a l D im e n s i o n s : S ch e m atic: 3.2 Max 0.2 118r i Notesi 1. SDlderabllity: Laads shall m ast M IL -ST D -2 0 2 G , Method 208H for solderabillty. 2. Rammablirty: U L94V-0 3. Electrical Specification: OCL: 10 u H ± 2 0 % 3 . AST M

Contextual Info: 1. M echanical D im ensions: 2 . S ch e m atic: 3. E le c tric al S p ec ific atio n s: OCL: 1DuH ±20% DCR: 0 .1 8 2 I DC: 1 OQKHz 0 .1 V O hm s Max 1 .1 5 A M ax Notes; 1. S alderobflity: Leads sholl m e e t M IL -S T D -2 0 Z G , CL M e tho d ,>1 208H

208H

Abstract: 58AD
Contextual Info: 1. Dimensions: 2. Schematic: o- o- X 3. Electrical Specs: o lb. dll OCL: o r"- 1 Z 0 u H ± 1 0% 1 K H z, 0.1V OADC OCL: 68.1 u H ± 1 0% @1KHz, 0.1V , 5.8ADC ca DC Res.: 0 .0 3 9 O hm s Max Notesi 1. Solderabllity: Leads shall meet MIL-STD-202G, Method 208H fo r solderabillty,

208H

Contextual Info: 2 . Schem atic: 1. Dimensions: o- c 3 .5 0 Max o3. Electrical Specs: OCL: 6 .8 u H ± 2 0 % 2.2 @1KHz, 0.5V DC Res.: 0 .0 5 5 O hm s Max DC C u rre n t: CO 1 .76A dc Max cn i< 1. S old e rab llity: Leads shall m a s t MIL— STD— Z02G, Method 208H f o r so ld e ra b iiity,

208H

Contextual Info: 1. M echan ical Dim ensions: O N j D ISvLJi7 0 .025 ^ 0 .5 5 0 0 ,3 0 0 Max c XF5006A -CMC6 YYWW ¡0 .0 4 0 0 .4 1 0 -0 ,5 0 0 - (SUGGESTED MOUNTING PAD) Notes: 1, SaldBrablllty: Leads shall m sst MIL-STD-2D2G, Method 208H fo r solderabllity. 2, Flammablllty: U L94V-0

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet M IL-STD-202G, Method 208H for solderability. 2. Flammability: U L94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

208H

Contextual Info: Schematic: Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155‘C. UL file E151556 5. Operating Temperature Range: All listed parameters

208H

Contextual Info: 1. M echanical D im ensions 2. Sch em atic: o-2T o- 3. E lectrical Specs: DCR: tbd Ohms Max Impedance: 510 Ohms Typ @25MHz 580 Ohms Typ 100MHz Notes: 1. Solderablllty: Leads shall meet M IL-STD -202G , Method 208H for solderability. 2. Flam mobility; U L94V-0

208H

Contextual Info: 1. Dimensions: 2. Schematic: o- o- X 3. Electrical Specs: o lb. dll OCL: 2 7 0 u H ± 1 0% 1 K H z , 0.1V OADC a OCL: tn o 13 4 .9 u H ± 10% @1KHz, 0.1V, DC Res.: 0 .0 8 2 3.4ADC Ohm s Max Notesi 1. Solderabllity: Leads shall meet MIL-STD-202G, Method 208H fo r solderabillty,

Contextual Info: TABLE OF QUARTZ CRYSTALS • Frequency range »few Low and medium-frequency quartz crystals tuning fork quartz crystals ï 208Hz 100 KHz C-001R • C-002RX • 32.768 KHz C-004R • 32.768 KHz C-005R • 32.768 KHz 1 MHz 24 MHz 40 MHz 64 MHz 32.768 KHz C-2-TYPE

208H

Abstract: VE1000
Contextual Info: 2 . Sch em atic: 1. M echanical D im ensions: PRI CO CM ° o ° o E h 2 1 HIPOT: 125Vrms, Wdg to Wdg t 1 Rated Voltage: 50Vdc Rated Current: 2A Notes: 1. Solderability: Leads shall meet MIL-STD-202G, Method 208H fo r solderability. 2. Flammabllity: UL94V—0

208H

Contextual Info: 1. M echanical D im ensions: X o -S m tn S - r \y CM co 0.004 0.638 Max 0.453 -ir 0.059 o to CO CD K CM O SUGGESTED PAD LAYOUT) Notes: 1. Solderability: Leads shall meet MIL—STD—202G, Method 208H fo r solderability. 2. Flammability: U L 94V -0 3. ASTM oxygen index: > 28%

w12 diode

Abstract: PCI4450 PC MOTHERBOARD schematic diagram
Contextual Info: PCI4450 GFN/GJG PC Card and OHCI Controller SCPS046 – JANUARY 1999 D 1997 PC Standard Compliant D PCI Bus Power Management Interface D D D D D D D D D D D D D D D D D D D D Specification 1.1 Compliant ACPI 1.0 Compliant PCI Local Bus Specification Revision

Contextual Info: TSB12LV26 OHCIĆLynx PCIĆBased IEEE 1394 Host Controller Data Manual 2000 Bus Solutions Printed in U.S.A., 03/00 SLLS366A TSB12LV26 OHCI-Lynx PCI-Based IEEE 1394 Host Controller Data Manual Literature Number: SLLS366A March 2000 Printed on Recycled Paper

cp27ug

Abstract: TMP91CP27U tmp91cu27u
Contextual Info: TOSHIBA Original CMOS 16-Bit Microcontroller TLCS-900/L1 Series TMP91CU27UG TMP91CP27UG TMP91CK27UG TMP91CU27FG Semiconductor Company Preface Thank you very much for making use of Toshiba microcomputer LSIs. Before use this LSI, refer the section, “Notes and Restrictions”.

transistor marking WC 2C

Abstract: E22/6/AS7620/TMS320C6678/AS7620/NZT6728-datasheet
Contextual Info: TMS320C6678 SPRS691E—November 2010—Revised March 2014 Multicore Fixed and Floating-Point Digital Signal Processor Check for Evaluation Modules EVM : TMS320C6678 1 TMS320C6678 Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x

Contextual Info: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz

IEC-60286-3 Vishay

Abstract: TR8Q227M004C1200 TR8M225M016C4000 TR8M105 TR8M106 TR8P476M010C0800 TR8M225M010C4000 TR8M1
Contextual Info: TR8 www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors MICROTAN Low ESR, Leadframeless Molded FEATURES • Lead Pb -free face-down terminations • Mounting: Surface mount • 8 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3

Contextual Info: TSB43AB23-EP IEEE 1394aĆ2000 OHCI PHY/Link Layer Controller Data Manual 2005 1394 Host Controller Solutions SGLS292 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue

AA4H

Abstract: 304M 400M S100 TSB43AB22
Contextual Info: TSB43AB22 Integrated 1394aĆ2000 OHCI PHY/LinkĆLayer Controller Data Manual NOTE 2001 Designing with this device may require extensive support. Before incorporating this device into a design, customers should contact TI or an Authorized TI Distributor. 1394 Host Controller Solutions

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion