GS840E18A
Abstract: GS840E32A GS840E36A
Text: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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GS840E18/32/36AT/B-190/180/166/150/100
840E18A
GS840E18A
GS840E32A
GS840E36A
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TS 100-12
Abstract: GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180
Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply
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PDF
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GS840H18/32/36AT/B-180/166/150/100
100-lead
840H18A
840E18
840H18
TS 100-12
GS840H18A
GS840H18AT-150
GS840H18AT-166
GS840H18AT-180
GS840H32A
GS840H36A
B180
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Untitled
Abstract: No abstract text available
Text: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply
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GS840E18/32/36AT/B-190/180/166/150/100
100-lead
119-Bump
GS840E18/32/362
1999E
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ESPC
Abstract: 0171B
Text: RealView Compilation Tools for BREW Version 1.2 Compilers and Libraries Guide Copyright 2001, 2002 ARM Limited. All rights reserved. ARM DUI 0171B RealView Compilation Tools for BREW Compilers and Libraries Guide Copyright © 2001, 2002 ARM Limited. All rights reserved.
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0171B
ESPC
0171B
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lenovo
Abstract: OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573
Text: 本图纸版权属原厂家所有 5 仅在服务该产品使用者时使用 4 3 立成网：综合性笔记本维修服务平台 2 1 < SONOMA > DC/DC & Charger CPU VR ARIES II BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V MAX6648 +VCCP C P:5 P:4 VCORE_VGA LVDS
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ADI3205
1715EEI
1999EEI
MAX1993ETG
MAX8527EUD
LP2989AILD-2
LP2996MRX
OZ862AS
CK410
CY28411
lenovo
OZ862AS
lenovo t42
VIA10
foxconn
FB-23
VIA15
FMC-101
Lenovo fpc
R4573
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Untitled
Abstract: No abstract text available
Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation
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Original
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PDF
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GS840E18/32/36AT/B-200/180/166/150/100
200MHzâ
100MHz
control2/362
2000G
GS840E18/32/362
032/2000G;
840E18
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B180
Abstract: V/GS840E18A
Text: GS840E18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply
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PDF
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GS840E18/32/36AGT/B-180/166/150/100
840E18A
B180
V/GS840E18A
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B180
Abstract: No abstract text available
Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply
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Original
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PDF
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GS840H18/32/36AT/B-180/166/150/100
840H18A
B180
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B180
Abstract: No abstract text available
Text: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply
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Original
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PDF
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GS840E18/32/36AT/B-180/166/150/100
840E18A
B180
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B180
Abstract: GS84018
Text: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply
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Original
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PDF
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GS84018/32/36T/B-180/166/150/100
100-lead
GS84018/32/362
1999E
032/2000G
032/2000G;
B180
GS84018
|
GS840E18A
Abstract: GS840E32A GS840E36A B180
Text: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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PDF
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GS840E18/32/36AT/B-180/166/150/100
100-lea
840E18A
GS840E18A
GS840E32A
GS840E36A
B180
|
GS840E18A
Abstract: GS840E32A GS840E36A
Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation
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Original
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PDF
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GS840E18/32/36AT/B-200/180/166/150/100
100table,
840E18A
GS840E18A
GS840E32A
GS840E36A
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180i
Abstract: GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180
Text: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply
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Original
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GS840E18/32/36AT/B-180/166/150/100
100-lead
119Code:
840E18A
180i
GS840E18A
GS840E18AT-166
GS840E18AT-180
GS840E32A
GS840E36A
B180
|
B180
Abstract: No abstract text available
Text: GS840H18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • High Output Drive current.
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Original
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GS840H18/32/36T/B-180/166/150/100
GS840H18/32/362
1999E
2000G
GS840E18/32/362
032/2000G;
840H18
B180
|
|
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GS840E18A
Abstract: GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A
Text: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply
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Original
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PDF
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GS840E18/32/36AT/B-190/180/166/150/100
100-lead
840E18A
GS840E18A
GS840E18AT-180
GS840E18AT-190
GS840E32A
GS840E36A
|
interworking between arm and thumb in arm7tdmi
Abstract: ARM1020E ARM1136JF-S ARM920T VFP10 JAN 6418 Rogue Wave Software
Text: RealView Compilation Tools Version 2.1 Compiler and Libraries Guide Copyright 2002-2004 ARM Limited. All rights reserved. ARM DUI 0205D RealView Compilation Tools Compiler and Libraries Guide Copyright © 2002-2004 ARM Limited. All rights reserved. Release Information
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0205D
their-62
int64
Index-12
interworking between arm and thumb in arm7tdmi
ARM1020E
ARM1136JF-S
ARM920T
VFP10
JAN 6418
Rogue Wave Software
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Untitled
Abstract: No abstract text available
Text: GS84018/32/36AGT/B*-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and
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GS84018/32/36AGT/B
GS84018/32/36A
840xxA
84018A
|
Untitled
Abstract: No abstract text available
Text: GS840E18/32/36AGT/B*-180/166/150/100 Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and bump 5R in the BGA . Holding the FT mode pin/bump low
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GS840E18/32/36AGT/B
GS840E18/32/36A
840E18A
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Untitled
Abstract: No abstract text available
Text: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation
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Original
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PDF
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GS84018/32/36AT/B-200/180/166/150/100
200MHzâ
100MHz
GS84018/32/36A1
2000G
032/2000G;
84018A
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS840H18/32/36AT/B-200/180/166 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.
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Original
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PDF
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GS840H18/32/36AT/B-200/180/166
poH18/32/36A1
GS840H18/32/36A1
2000G
032/2000G;
840H18A
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B180
Abstract: No abstract text available
Text: GS840E18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation. • 3.3V +10%/-5% Core power supply
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Original
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PDF
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GS840E18/32/36T/B-180/166/150/100
100-lead
GS840E18/32/362
1999E
2000G
032/2000G;
B180
|
GS84018
Abstract: B180
Text: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply
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Original
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PDF
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GS84018/32/36T/B-180/166/150/100
100-lead
GS84018/32/362
1999E
032/2000G
032/2000G;
GS84018
B180
|
Untitled
Abstract: No abstract text available
Text: BYW77G-200 HIGH EFFICIENCY FAST RECOVERY DIODES MAIN PRODUCT CHARACTERISTICS I f a v 25 A V rrm trr 200 V 50 ns VF 0.85 V 1 & 3—^ |—4 FEATURES AND BENEFITS 1 • VERYSMALLCONDUCTION LOSSES ■ NEGLIGIBLE SWITCHING LOSSES ■ LOW FORWARD AND REVERSE RECOVERY
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OCR Scan
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PDF
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BYW77G-200
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Untitled
Abstract: No abstract text available
Text: STPS3L25S LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS If av 3A V rrm 25 V Tj (max) 150°C V f (max) 0.44 V FEATURES AND BENEFITS • VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION ■ OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST
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OCR Scan
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PDF
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STPS3L25S
DO-214AB
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