1999E Search Results

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

TS 100-12

Abstract: GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180
Contextual Info: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

Contextual Info: BYW77G-200 HIGH EFFICIENCY FAST RECOVERY DIODES MAIN PRODUCT CHARACTERISTICS I f a v 25 A V rrm trr 200 V 50 ns VF 0.85 V 1 & 3—^ |—4 FEATURES AND BENEFITS 1 • VERYSMALLCONDUCTION LOSSES ■ NEGLIGIBLE SWITCHING LOSSES ■ LOW FORWARD AND REVERSE RECOVERY

Contextual Info: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

ESPC

Abstract: 0171B
Contextual Info: RealView Compilation Tools for BREW Version 1.2 Compilers and Libraries Guide Copyright 2001, 2002 ARM Limited. All rights reserved. ARM DUI 0171B RealView Compilation Tools for BREW Compilers and Libraries Guide Copyright © 2001, 2002 ARM Limited. All rights reserved.

lenovo

Abstract: OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573
Contextual Info: 本图纸版权属原厂家所有 5 仅在服务该产品使用者时使用 4 3 立成网：综合性笔记本维修服务平台 2 1 < SONOMA > DC/DC & Charger CPU VR ARIES II BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V MAX6648 +VCCP C P:5 P:4 VCORE_VGA LVDS

Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation

B180

Abstract: V/GS840E18A
Contextual Info: GS840E18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

B180

Abstract: GS84018
Contextual Info: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply

GS840E18A

Abstract: GS840E32A GS840E36A B180
Contextual Info: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

GS840E18A

Abstract: GS840E32A GS840E36A
Contextual Info: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation

180i

Abstract: GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180
Contextual Info: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

Contextual Info: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features • FT pin for user-configurable flow through or pipelined

GS840E18A

Abstract: GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A
Contextual Info: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply

Contextual Info: STPS3L25S LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS If av 3A V rrm 25 V Tj (max) 150°C V f (max) 0.44 V FEATURES AND BENEFITS • VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION ■ OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST

interworking between arm and thumb in arm7tdmi

Abstract: ARM1020E ARM1136JF-S ARM920T VFP10 JAN 6418 Rogue Wave Software
Contextual Info: RealView Compilation Tools Version 2.1 Compiler and Libraries Guide Copyright 2002-2004 ARM Limited. All rights reserved. ARM DUI 0205D RealView Compilation Tools Compiler and Libraries Guide Copyright © 2002-2004 ARM Limited. All rights reserved. Release Information

Contextual Info: GS84018/32/36AGT/B*-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and

Contextual Info: GS840E18/32/36AGT/B*-180/166/150/100 Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and bump 5R in the BGA . Holding the FT mode pin/bump low

Contextual Info: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz–100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation

Contextual Info: Preliminary GS840H18/32/36AT/B-200/180/166 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.

B180

Contextual Info: GS840E18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation. • 3.3V +10%/-5% Core power supply

GS84018

Abstract: B180
Contextual Info: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply