176BYTE Search Results

M395T6553GZ4-CE66

Contextual Info: SERIAL PRESENCE DETECT M395T6553GZ4-E66 512MB FBDIMM : M395T6553GZ4-CE66 Byte # Function Supported Hex Value E66 E66 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD B yte Use : 176Byte 92h Function Described Note Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage

M395T2953GZ4-CE66

Abstract: CE66 TRP15ns
Contextual Info: SERIAL PRESENCE DETECT M395T2953GZ4-CE66 1GB FBDIMM : M395T2953GZ4-CE66 Byte # Function Supported Hex Value CE66 CE66 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD B yte Use : 176Byte 92h Function Described Note Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage

M395T5750GZ4-CE66

Abstract: CE66
Contextual Info: SERIAL PRESENCE DETECT M395T5750GZ4-CE66 2GB FBDIMM : M395T5750GZ4-CE66 Byte # Function Supported Hex Value CE66 CE66 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD B yte Use : 176Byte 92h Function Described Note Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage

M395T1G60QJ4-CE68

Abstract: CE68
Contextual Info: SERIAL PRESENCE DETECT M395T1G60QJ4-CE68 8GB FBDIMM : M395T1G60QJ4-CE68 Byte # Function Supported Hex Value CE68 CE68 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD B yte Use : 176Byte 92h Function Described Note Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage

M395T2953CZ4-CD50

Abstract: CD50 M395T2953CZ4
Contextual Info: SERIAL PRESENCE DETECT M395T2953CZ4-CD50/CE60 1GB FBDIMM :M395T2953CZ4-CD50/CE60 Contents : Byte # Function described Function Supported CD50 CE60 Hex Value CD50 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD Byte Use : 176Byte CE60 Number of Serial PD Bytes Written / SPD Device Size / CRC

M395T1G60QJ4-CF78

Abstract: 25H40
Contextual Info: SERIAL PRESENCE DETECT M395T1G60QJ4-CF78 8GB FBDIMM : M395T1G60QJ4-CF78 Byte # Function Supported Hex Value CF78 CF78 CRC coverage 0~116Byte, SPD Byte Total :256Byte, SPD B yte Use : 176Byte 92h Function Described Note Number of Serial PD Bytes Written / SPD Device Size / CRC Coverage

S3P826

Abstract: S3C826A S3P826A INT8-INT11 dot led display large size with circuit diagram TB826 208QFP
Contextual Info: 21-S3-C826A/P826A-112002 USER'S MANUAL S3C826A/P826A 8-Bit CMOS Microcontroller Revision 1 S3C826A/P826A 1 PRODUCT OVERVIEW PRODUCT OVERVIEW S3C8-SERIES MICROCONTROLLERS Samsung's S3C8 series of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU, a wide range

Contextual Info: 240PIN DDR2 667 Fully Buffered DIMM 1GB With 64Mx8 CL5 TS128MFB72V6J-T Description MBIST and IBIST Test functions The TS128MFB72V6J-T is a 128M x 72bits DDR2-667 Hot add-on and Hot Remove Capability Fully Buffered DIMM. The TS128MFB72V6J-T consists of Transparent mode for DRAM test support

Contextual Info: TS128MFB72V6J-T 240PIN DDR2 667 Fully Buffered DIMM 1GB With 64Mx8 CL5 Description Hot add-on and Hot Remove Capability The TS128MFB72V6J-T is a 128M x 72bits DDR2-667 Transparent mode for DRAM test support Fully Buffered DIMM. The TS128MFB72V6J-T consists of

M471B5673FH0-CF8

Abstract: M471B5673 ddr3 spd samsung M471B5673FH0-CF8/CH9/CK0
Contextual Info: SERIAL PRESENCE DETECT M471B5673FH0-CF8/CH9/CK0 Organization : 256M x 64 Composition : 128M x 8 * 16ea Used component part # : K4B1G0846F-HCF8/CH9/CK0 # of rows in module : 2 Rows # of banks in component : 8 Banks Feature : 30mm height & double sided component

c826a

Abstract: S3P826A FM24653 ISO-14001 S3C826A P826A QFP28 144-QFP-2828-AN TB826 TB826a
Contextual Info: 21-S3-C826A/P826A-112002 USER'S MANUAL S3C826A/P826A 8-Bit CMOS Microcontroller Revision 1 S3C826A/P826A 8-BIT CMOS MICROCONTROLLERS USER'S MANUAL Revision 1 Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at

s3f82nb

Abstract: TB82NB FM24653 H-26 ISO-14001
Contextual Info: USER'S MANUAL S3F82NB 8-BIT CMOS MICROCONTROLLERS May 2009 Revision 1.00 Confidential Proprietary of Samsung Electronics Co., Ltd Copyright 2009 Samsung Electronics, Inc. All Rights Reserved Important Notice The information in this publication has been carefully

Contextual Info: 240PIN DDR2 667 Fully Buffered DIMM 2GB With 128Mx4 CL5 TS256MFB72V6K-T Description Programmable CAS Latency: 3, 4, 5 The TS256MFB72V6K-T is a 256M x 72bits DDR2-667 Automatic DDR2 DRAM bus and channel calibration Fully Buffered DIMM. The TS256MFB72V6K-T consists

Contextual Info: 240PIN DDR2 667 Fully Buffered DIMM 512MB With 64Mx8 CL5 TS64MFB72V6J-T Description Hot add-on and Hot Remove Capability The TS64MFB72V6J-T is a 64M x 72bits DDR2-667 Fully Transparent mode for DRAM test support Buffered DIMM. The TS64MFB72V6J-T consists of 9 pcs

Contextual Info: Advance Information TM57PR40 8-Bit Microcontroller Data Sheet Tenx reserves the right to change or discontinue this product without notice. tenx technology inc. Preliminary 1 tenx technology, inc. Rev 1.2, 2008/08/13 Advance Information DS-TM57PR40 FEATURE

samsung dimm DDR3 SPD

Abstract: samsung DDR3 SDRAM 2GB M378B5273 M378B5273BH1-CF7 samsung K4B2G0846B DDR3 SPD ddr3 datasheet samsung ddr3 samsung dimm DDR3 COLUMN10
Contextual Info: SERIAL PRESENCE DETECT M378B5273BH1-CF7/CF8/CH9/CK0 Organization : 512M x 64 Composition : 256M x 8 * 16ea Used component part # : K4B2G0846B-HCF7/CF8/CH9/CK0 # of rows in module : 2 Rows # of banks in component : 8 Banks Feature : 30mm height & double sided component

samsung dimm DDR3 SPD

Abstract: CF701 inphi SSTE32882 HCH9 samsung DDR3 SDRAM 2GB GS-04 M393B1K70 RC10 RC11
Contextual Info: SERIAL PRESENCE DETECT M393B1K70BH1-CF701/CF801/CH901/CK001 Organization : 1G x 72 Composition : 512M x 4 * 36ea Used component part # : K4B2G0446B-HCF7/HCF8/HCH9/HCK0 # of rows in module : 2 Row # of banks in component : 8 Banks Feature : 30mm height & double sided component

samsung dimm DDR3 SPD

Abstract: M378B2873EH1-CF7 samsung ddr3 Samsung ddr3 1600 SDRAM hcf7 K4B1G0846E DDR3 DIMM SPD JEDEC DDR3 SPD sensor ddr3 spd samsung
Contextual Info: SERIAL PRESENCE DETECT M378B2873EH1-CF7/CF8/CH9/CK0 Organization : 128M x 64 Composition : 128M x 8 * 8ea Used component part # : K4B1G0846E-HCF7/CF8/CH9/CK0 # of rows in module : 1 Row # of banks in component : 8 Banks Feature : 30mm height & single sided component

intel 80C51 ALU

Abstract: ST90R50 st7275 68hc12 motorola linker P80C32GBPN 68HC05 68HC11 68HC12 ST7 series MCU 80C51
Contextual Info: APPLICATION NOTE ST7 AND ST9 PERFORMANCE BENCHMARKING by A. Albella, G. Bouvier and J. Pauvert ABSTRACT SGS-THOMSON has developed a set of test routines relevant to 8-bit and low-end 16-bit microcontroller applications to evaluate computing performance and interrupt processing

wiring diagram brushless AC motor

Abstract: IEC555-1 2x27k AN1590 IR2112 circuit motors simple dc motor model MOTOROLA sensorless brushless dc controller IR2112 application note 300w dc motor speed controller LM339n as motor controller
Contextual Info: Order this document by AN1627/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1627 LOW COST HIGH EFFICIENCY SENSORLESS DRIVE FOR BRUSHLESS DC MOTOR USING MC68HC 7 05MC4 By Leos Chalupa Roznov System Application Laboratory Motorola, Roznov pod Radhostem, Czech Republic

ST90R50

Abstract: 8 BIT ALU cisc architecture in 8051 A7800 P80C32GBPN arithmetic instruction for microcontroller 68HC11 8 bit to two 7 segment circuit P51XAG35 iar ide version 3.5 h8 nec mcu
Contextual Info: AN910 APPLICATION NOTE ST7 AND ST9 PERFORMANCE BENCHMARKING INTRODUCTION STMicroelectronics has developed a set of test routines related to 8-bit and low-end 16-bit microcontroller applications to evaluate computing performance and interrupt processing performance of microcontroller cores. These routines have been implemented on ST7 and

CF-800

Abstract: samsung DDR3 SDRAM 2GB CF700 HCF8 M471B5273CH0 CF800 CF-700 CH900 Samsung ddr3 1600 SDRAM k4b2g0846c
Contextual Info: SERIAL PRESENCE DETECT M471B5273CH0-CF700/CF800/CH900/CK000 Organization : 512M x 64 Composition : 256M x 8 * 16ea Used component part # : K4B2G0846C-HCF7/HCF8/HCH9/HCK0 # of rows in module : 2 Rows # of banks in component : 8 Banks Feature : 30mm height & double sided component

M471B2873EH1-CF7

Abstract: Samsung ddr3 1600 SDRAM samsung ddr3 ddr3 spd samsung
Contextual Info: SERIAL PRESENCE DETECT M471B2873EH1-CF7/CF8/CH9/CK0 Organization : 128M x 64 Composition : 128M x 8 * 8ea Used component part # : K4B1G0846E-HCF7/CF8/CH9/CK0 # of rows in module : 1 Rows # of banks in component : 8 Banks Feature : 30mm height & double sided component

SSTE32882

Abstract: samsung dimm DDR3 SPD HCH9 CF804 LVDDR3 K4B1G0846E samsung ddr3 RC10 RC11 RC12
Contextual Info: SERIAL PRESENCE DETECT M393B5673EH1-CF704/CF804/CH904/CK004 Organization : 256M x 72 Composition : 128M x 8 * 18ea Used component part # : K4B1G0846E-HCF7/HCF8/HCH9/HCK0 # of rows in module : 2 Row # of banks in component : 8 Banks Feature : 30mm height & double sided component