13X22MM Search Results
13X22MM Price and Stock
HURAGAN CS-DCH X CRS 125X 13X 22MMWheel; Dim: Ø125x13mm; Mount.hole diam: 22mm |
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CS-DCH X CRS 125X 13X 22MM | 20 | 1 |
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HURAGAN CS-DCH X CRS 150X 13X 22MMWheel; Dim: Ø150x13mm; Mount.hole diam: 22mm |
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CS-DCH X CRS 150X 13X 22MM | 20 | 1 |
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HURAGAN CS-RDH X CRS 115X 13X 22MMWheel; Dim: Ø115x13mm; Mount.hole diam: 22mm |
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CS-RDH X CRS 115X 13X 22MM | 16 | 1 |
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HURAGAN CS-RDH X CRS 125X 13X 22MMWheel; Dim: Ø125x13mm; Mount.hole diam: 22mm |
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CS-RDH X CRS 125X 13X 22MM | 9 | 1 |
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13X22MM Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: White Electronic Designs W78M32V-XBX ADVANCED* 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M32V-XBX 8Mx32 120ns 13x22mm | |
10001000XXX
Abstract: PWA with 555 W78M32V-XBX SA139-SA142 SA175-SA178 SA187-SA190 SA163-SA166
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W78M32V-XBX 8Mx32 120ns 13x22mm 10001000XXX PWA with 555 W78M32V-XBX SA139-SA142 SA175-SA178 SA187-SA190 SA163-SA166 | |
Contextual Info: White Electronic Designs W78M64V-XSBX PRELIMINARY 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M64V-XSBX 8Mx64 120ns 13x22mm 8Mx64, 2x8Mx32 4x8Mx16 | |
bsc 60hContextual Info: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing |
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W72M64V-XBX 2Mx64 150ns 13x22mm 2x2Mx32 100ns 120ns 150ns bsc 60h | |
W78M32V-XBXContextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M32V-XBX 8Mx32 120ns 13x22mm W78M32V-XBX | |
Contextual Info: White Electronic Designs W78M32V-XBX PRELIMINARY* 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M32V-XBX 8Mx32 120ns 13x22mm | |
Contextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M32V-XBX 8Mx32 120ns 13x22mm | |
Contextual Info: White Electronic Designs W78M64V-XSBX PRELIMINARY 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M64V-XSBX 8Mx64 120ns 13x22mm 8Mx64, 2x8Mx32 4x8Mx16 | |
W78M64V-XSBX
Abstract: SA159-SA162 SA222
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W78M64V-XSBX 8Mx64 120ns 13x22mm W78M64V-XSBX SA159-SA162 SA222 | |
Contextual Info: White Electronic Designs W78M64V-XSBX ADVANCED 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M64V-XSBX 8Mx64 120ns 13x22mm | |
W78M64V-XSBXContextual Info: White Electronic Designs W78M64V-XSBX 8Mx64 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing |
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W78M64V-XSBX 8Mx64 120ns 13x22mm W78M64V-XSBX | |
Contextual Info: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations |
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W72M64V-XBX 16MByte 128Mb) 2Mx64 150ns x64/x72 W72M64V-XBX MIF2033 | |
W72M64V-XBXContextual Info: W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Preliminary FEATURES ! Access Times of 100, 120, 150ns ! Unlock Bypass Program command ! Packaging • Reduces overall programming time when issuing multiple program command sequences |
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W72M64V-XBX 2Mx64 150ns 13x22mm 100ns 120ns W72M64V-XBX | |
W78M64VP-XSBX
Abstract: W78M64VP
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W78M64VP-XSBX 8Mx64 120ns 13x22mm W78M64VP-XSBX W78M64VP | |
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000FFFFH
Abstract: 0x0055
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W78M64VP-XSBX 8Mx64 120ns 13x22mm 128KB 000FFFFH 0x0055 | |
W72M64VK-XBX
Abstract: W72M64V-XBX
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W72M64VK-XBX 2Mx64 120ns 13x22mm 2Mx16 100ns W72M64VK-XBX W72M64V-XBX | |
Contextual Info: White Electronic Designs W72M64VB-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Packaging • Write protect WP# function allows protection two outermost boot sectors, regardless of sector |
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W72M64VB-XBX 2Mx64 120ns 13x22mm 64-Kbyte -70ns | |
Contextual Info: W78M32VP-XBX 8Mx32 NOR Flash 3.3V Page Mode Multi-Chip Package FEATURES GENERAL DESCRIPTION Access Times of 110, 120ns The W78M32VP-XBX is a 256Mb, 3.3 volt-only Page Mode memory device. Packaging The device offers fast page access times allowing high speed |
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W78M32VP-XBX 8Mx32 120ns W78M32VP-XBX 256Mb, 13x22mm 128Kb) DQ16-31 | |
W78M32VPContextual Info: White Electronic Designs W78M32VP-XBX 8Mx32 Flash 3.3V Page Mode Multi-Chip Package FEATURES Access Times of 110, 120ns Packaging Page Mode • 128-word sector for permanent, secure identification through an 8-word random Electronic Serial Number, accessible through a command |
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W78M32VP-XBX 8Mx32 120ns 13x22mm W78M32VP | |
Contextual Info: W78M64VP-XSBX 8Mx64 NOR Flash 3.3V Page Mode Multi-Chip Package FEATURES STANDARD FLASH MEMORY FEATURES Access Times of 110, 120ns The device requires a 3.3 volt power supply for both read and write functions. Internally generated and regulated voltages are provided |
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W78M64VP-XSBX 8Mx64 120ns 13x22mm | |
W72M64VB-XBXContextual Info: White Electronic Designs W72M64VB-XBX *ADVANCED 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Packaging • Write protect WP# function allows protection two outermost boot sectors, regardless of sector |
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W72M64VB-XBX 2Mx64 120ns 13x22mm 64-Kbyte 100ns W72M64VB-XBX | |
MX116Contextual Info: White Electronic Designs W78M64VP-XSBX *ADVANCED 8Mx64 Flash 3.3V Page Mode Multi-Chip Package FEATURES Access Times of 110, 120ns Secured Silicon Sector region Packaging Page Mode • 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random |
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W78M64VP-XSBX 8Mx64 120ns 13x22mm 128KB 100ns 110ns MX116 | |
Contextual Info: White Electronic Designs W72M64VB-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Packaging • Write protect WP# function allows protection two outermost boot sectors, regardless of sector |
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W72M64VB-XBX 2Mx64 120ns 13x22mm 64-Kbyte 100ns |