112905HC02 Search Results

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Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die ECN 112905HC02 011411HC03 021811HC04 022311HC05