021811HC04 Search Results

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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die ECN 112905HC02 011411HC03 021811HC04 022311HC05	Original	PDF	SOICW-20LD-GRN-RS-1 112905HC02 011411HC03 021811HC04 022311HC05

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die ECN 112905HC02 011411HC03 021811HC04 022311HC05

Original

PDF

SOICW-20LD-GRN-RS-1 112905HC02 011411HC03 021811HC04 022311HC05