PGA-208c-a02
Abstract: PGA209-C-S17U-1
Text: PIN GRID ARRAY PACKAGE 208 PIN CERAMIC PGA-208C-A02 EIAJ code : ∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100mil Pin matrix 17 Sealing method Metal seal (PGA-208C-A02) 208-pin ceramic PGA (PGA-208C-A02)
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PGA-208C-A02
PGA209-C-S17U-1
100mil
208-pin
PGA-208C-A02)
R208002SC-2-2
PGA-208c-a02
PGA209-C-S17U-1
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PDF
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a06 transistor
Abstract: 179-PIN
Text: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A06 179-pin ceramic PGA Lead pitch 100mil Pin matrix 16 Sealing method Metal seal PGA-179C-A06 179-pin ceramic PGA (PGA-179C-A06) 2.54 ± 0.25 (.100 ± .010) 35.99 (1.417) DIA TYP 1.27 (.050) DIA TYP (4 PLCS)
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PGA-179C-A06
100mil
179-pin
PGA-179C-A06)
R179009SC-1-2
a06 transistor
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PDF
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149C
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A03 EIAJ code : HPGA149-C-S15D-2 149-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-149C-A03 149-pin ceramic PGA (PGA-149C-A03) 2.54 ± 0.25 (.100 ± .010) 36.00 (1.417) DIA 0.46 ± 0.05
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PGA-149C-A03
HPGA149-C-S15D-2
100mil
149-pin
PGA-149C-A03)
R149002SC-3-2
149C
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PDF
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 149 PIN CERAMIC PGA-149C-A09 EIAJ code : HPGA149-C-S15D-3 Lead pitch 100mil Pin matrix 15 Sealing method Metal seal 149-pin ceramic PGA PGA-149C-A09 149-pin ceramic PGA (PGA-149C-A09) 2.54 ± 0.25 (.100 ± .010) 0.46 +– 0.05 0.08
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PGA-149C-A09
HPGA149-C-S15D-3
100mil
149-pin
PGA-149C-A09)
R149009SC-2-2
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A05 256-pin ceramic PGA Lead pitch 100mil Pin matrix 19 Sealing method Metal seal PGA-256C-A05 256-pin ceramic PGA (PGA-256C-A05) 3.40 +– 0.41 0.36 (.134 +– .016 .014 ) 8.89 (.350) MAX 1.27 ± 0.25 (.050 ± .010)
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PGA-256C-A05
100mil
256-pin
PGA-256C-A05)
R256007SC-2-2
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PDF
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PGA-121C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 121 PIN CERAMIC PGA-121C-A02 121-pin ceramic PGA Lead pitch 100mil Pin matrix 13 Sealing method Metal seal PGA-121C-A02 121-pin ceramic PGA (PGA-121C-A02) 0.46 +– 0.05 0.08 DIA (.018 +– .002 .003 ) 2.54 ± 0.25 (.100 ± .010) 27.00 (1.063)
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PGA-121C-A02
100mil
121-pin
PGA-121C-A02)
R121002SC-1-2
PGA-121C-A02
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PDF
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PGA089-C-S12U-2
Abstract: 88PIN
Text: PIN GRID ARRAY PACKAGE 88 PIN CERAMIC PGA-88C-A02 EIAJ code : ∗PGA089-C-S12U-2 88-pin ceramic PGA Number of pins 89 pins includes extra index pin Lead pitch 100mil Pin matrix 12 Sealing method Metal seal (PGA-88C-A02) 88-pin ceramic PGA (PGA-88C-A02) 0.46 +– 0.18
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PGA-88C-A02
PGA089-C-S12U-2
100mil
88-pin
PGA-88C-A02)
R88006SC-3-2
PGA089-C-S12U-2
88PIN
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PDF
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PGA179-C-S15U-2
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 179 PIN CERAMIC PGA-179C-A03 EIAJ code : ∗PGA179-C-S15U-2 179-pin ceramic PGA Lead pitch 100mil Pin matrix 15 Sealing method Metal seal PGA-179C-A03 179-pin ceramic PGA (PGA-179C-A03) 2.54±0.25 (.100±.010) 35.56(1.400) REF 1.27(.050)TYP DIA
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PGA-179C-A03
PGA179-C-S15U-2
100mil
179-pin
PGA-179C-A03)
R179004SC-3-2
PGA179-C-S15U-2
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PDF
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PGA-299C-A01
Abstract: PGA299-C-S20D-1
Text: PIN GRID ARRAY PACKAGE 299 PIN CERAMIC PGA-299C-A01 EIAJ code : ∗PGA299-C-S20D-1 299-pin ceramic PGA Lead pitch 100mil Pin matrix 20 Sealing method Metal seal PGA-299C-A01 299-pin ceramic PGA (PGA-299C-A01) 2.41 ± 0.10 (.095 ± .004) 1.65 ± 0.10 (.065 ± .004)
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PGA-299C-A01
PGA299-C-S20D-1
100mil
299-pin
PGA-299C-A01)
R299001SC-2-2
PGA-299C-A01
PGA299-C-S20D-1
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PDF
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Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 80 PIN CERAMIC PGA-80C-A01 EIAJ code : HPGA080-C-S12D-1 80-pin ceramic PGA Lead pitch 100mil Pin matrix 12 Sealing method Metal seal PGA-80C-A01 80-pin ceramic PGA (PGA-80C-A01) 2.54±0.25 (.100±.010) 27.00(1.063)DIA 27.94(1.100)
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PGA-80C-A01
HPGA080-C-S12D-1
100mil
80-pin
PGA-80C-A01)
R80001SC-3-2
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PDF
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FM20
Abstract: FN812
Text: Power Transistor FN812 ICBO IEBO VCEO hFE VCE sat (Ta=25ºC) Unit µA µA V Ratings 10max 10max 100min 70min 0.3max External Dimensions FM20 (full-mold) 10.0 V a b Typical Switching Characteristics VCC (V) 12 RL (Ω) 4 IC (A) 3 VBB1 (V) 10 VBB2 (V) –5
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FN812
10max
100min
70min
FM20
FN812
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Untitled
Abstract: No abstract text available
Text: Equivalent circuit SAH02 2 1 Silicon PNP Epitaxial Planar Transistor with Shottky Barrier Diode µA IEBO VEB=–10V –10max µA V BR CEO IC=–10mA –30min V ICBO VCEO –30 V VEBO –10 V IC –3 A hFE1 VCE=–2V, IC=–1A 100min IB –0.5 A hFE2 VCE=–2V, IC=–0.5A
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SAH02
10max
30min
100min
150min
100typ
45typ
100mA
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EPA120B-100P
Abstract: 100MIL
Text: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 01/13/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA120B-100P
100MIL
12GHz
18GHz
175oC
-65/175oC
EPA120B-100P
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100MIL
Abstract: EPA240D-100P AuSn eutectic
Text: EPA240D-100P High Efficiency Heterojunction Power FET UPDATED 11/14/2005 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +33 dBm TYPICAL OUTPUT POWER 20 dB TYPICAL POWER GAIN AT 2GHz 0.4 X 2400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA240D-100P
100MIL
120mA
620mA
EPA240D-100P
AuSn eutectic
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MA 7824
Abstract: EPA120B-100P 100MIL
Text: EPA120B-100P High Efficiency Heterojunction Power FET UPDATED 10/30/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +29.0dBm TYPICAL OUTPUT POWER 11.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 1200 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA120B-100P
100MIL
12GHz
18GHz
MA 7824
EPA120B-100P
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PDF
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100MIL
Abstract: GaAs FET EFA025A
Text: EFA025A-100P Low Distortion GaAs Power FET UPDATED 11/17/2006 • • • • • • NON-HERMETIC 100MIL METAL FLANGE PACKAGE +21.0dBm TYPICAL OUTPUT POWER 9.5dB TYPICAL POWER GAIN AT 12GHz 0.3 X 250 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION ADVANCED EPITAXIAL HETEROJUNCTION
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EFA025A-100P
100MIL
12GHz
18GHz
GaAs FET EFA025A
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PDF
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DIP-24P-M04
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012
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DIP-24P-M04
DIP024-P-0400-1
100mil
400mil
24-pin
DIP-24P-M04)
D24025S-3C-3
DIP-24P-M04
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1
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DIP-28P-M05
DIP028-P-0600-2
100mil
600mil
28-pin
DIP-28P-M05)
D28013S-3C-2
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PDF
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DIP-14P-M02
Abstract: DIP14-P
Text: DUAL IN-LINE PACKAGE 14 PIN PLASTIC DIP-14P-M02 EIAJ code : ∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP (DIP-14P-M02) +0.20 19.55 –0.30 +.008 .770 –.012 INDEX-1
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DIP-14P-M02
DIP014-P-0300-1
100mil
300mil
14-pin
DIP-14P-M02)
D14010S-4C-3
DIP-14P-M02
DIP14-P
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PDF
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M02 EIAJ code : ∗DIP040-P-0600-2 40-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M02 40-pin plastic DIP (DIP-40P-M02) +0.20 52.40 –0.30 +.008 2.063 –.012 INDEX-1
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DIP-40P-M02
DIP040-P-0600-2
100mil
600mil
40-pin
DIP-40P-M02)
D40011S-2C-2
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PDF
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DIP-20P-M02
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 20 PIN PLASTIC DIP-20P-M02 EIAJ code : ∗DIP020-P-0300-2 20-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-20P-M02 20-pin plastic DIP (DIP-20P-M02) +0.20 24.64 –0.30 .970 +.008 –.012 INDEX-1
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DIP-20P-M02
DIP020-P-0300-2
100mil
300mil
20-pin
DIP-20P-M02)
D20003S-3C-4
DIP-20P-M02
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PDF
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34036
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 42 PIN CERAMIC DIP-42C-A03 EIAJ code : WDIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-42C-A03 42-pin ceramic DIP (DIP-42C-A03) 53.34±0.51 (2.100±0.20) 8.50(.335)DIA. TYP R1.27(.050)
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DIP-42C-A03
WDIP042-C-0600-1
100mil
600mil
42-pin
DIP-42C-A03)
D42012SC-2-3
34036
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PDF
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Untitled
Abstract: No abstract text available
Text: 5/U3:/NPN=*ffiÄ*iflBh5:/Stt9 G-TR 2SD SILICON NPN TRIPLE DIFFUSED MESA TRANSISTOR G-TR ) I Is i * i TENTATIVE INDUSTRIAL APPLICATIONS O * 1 / ] ^ -f ? o High Power Switching Applications Unit in mm H f e = 100MIN. ' ( I q — 400A) Battery Car üse M A X I M U M RATIN GS ( T c = 2 5 t )
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OCR Scan
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100MIN.
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PDF
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Resistance
Abstract: AC-71
Text: aL A/D ELECTRONICS, INC 5P DIN SOCKET: Insulation Resistance: 100Mi at 500 V.D.C D ielectric Strength: 1,000V A.C.71 Minute C o n tact Resistance: 20mC Maximum. Rating: 100V A.C. 2A iti f i r ^ ¿o o j A D S -125 ^fsn C R T SOCKET: Contact Resistance: 30mfl M AX
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OCR Scan
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100Mi)
ACRT-001
30mfl
100MQ
100MD
ACRT-002
ACRT-003
Resistance
AC-71
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PDF
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