1.0MM PITCH BGA Search Results

1mm pitch BGA socket

Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Contextual Info: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)

TEXTOOL

Abstract: land pattern BGA 0,50 3M 2380
Contextual Info: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm

Contextual Info: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply

AS4DDR32M72PBG

Contextual Info: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply

Contextual Info: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply

Contextual Info: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „

W3H64M64E

Contextual Info: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „

18CO

Contextual Info: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch

84 FBGA

Abstract: IPC17 FBGA-84
Contextual Info: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 72 • 1.0mm pitch

CEE 32

Abstract: W3H32M64E-XSBX
Contextual Info: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature

Wells-CTI

Abstract: 8109-064-1E-0X 8113B064A1E-0X wells-cti 672 811725 wells 28919X 8722a 8127-676-1E-0X 811514
Contextual Info: Burn-In Test Sockets Series 8100 VABGA Sockets • • • • • • • Open top, Vertically Actuated Ball Grid Array Accommodates 1.0mm pitch package Proven, low force, high pressure “spoon” contacts Contacts are independent of one another Two points of contact per solder ball

84 FBGA

Abstract: W3H64M72E-XSBX fbga84 ccd400
Contextual Info: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ Organized as 64M x 72 • 1.0mm pitch „ Weight: W3H64M72E-XSBX - 2.5 grams typical

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)

bail

Contextual Info: I ADVANCED Ball Grid Array BGA Sockets » INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://www.advintcorp.com Standard S ocket (S):

pitch 0.75mm BGA

Contextual Info: Ball Grid Array BGA Adapters 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Standard Adapter (A) Now Available In 0.75mm Pitch • Mates with Standard Socket (S)

BGA reflow guide

Abstract: pitch 0.75mm BGA 1024 ball bga
Contextual Info: Ball Grid Array BGA Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Adapters Standard Adapter (A): Extraction Slot Adapter (AX):

eutectic 157

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter

Contextual Info: Press Releases CYPRESS INTRODUCES DUAL-PORTS IN BGA PACKAGES 7.2 Gbps FLEx36 Housed in Manufacturing-Friendly 1.0-mm Lead Pitch BGA SAN JOSE, Calif., November 5, 1999 - Cypress Semiconductor Corp. NYSE:CY today announced that the four members of the FLEx36 family of x36 dual-port SRAMs will be offered in 172-ball, 15 mm x

Contextual Info: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB

diode b6 k 450

Abstract: CTS RESISTOR NETWORK F-120 RT1400B6 RT1401B6 RT1402B6 RT1403B6 RT1404B6 RT1405B6 SSTL-2
Contextual Info: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high

Contextual Info: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high