05MAY05 Search Results

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. _ i_ ALL RIGHTS RESERVED. LOC DIST AF 50 REVISIONS LTR D DESCRIPTION REV PER ECR 0 5 - 0 0 2 3 5 8 DATE OWN APVD 05MAY05 JR GJ D D .220 E 5 .5 9 J P IT C H

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 6 4 2 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS D IS T AD 00 LTR 01 H O U SIN G 53.34[2.100] MAX POST — 44. 65 [ 1.758]-0.94+0.05 TYP [.037+.002] — - 0 .0 8

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 6 4 2 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AD 25 R E VIS IO N S LTR DESCRIPTION 01 9 5 [ 3 . 7 4 0 ] MAX HOUSING MATERIAL: POST MATERIAL: 90+0.1 [3.543+.004]-

VSSX1284

Contextual Info: VSSX1284 Vishay Thin Film 25 Mil Pitch, IEEE 1284 Termination Network Resistor, Capacitor, Diode FEATURES • Lead Pb -Free available Product is pictured larger than actual size to show detail • Standard QSOP package (28 pins) - JEDEC mo-137AF • 17 terminating lines

SN62

Abstract: SOT 143 footprint
Contextual Info: SURFACE MOUNT NETWORKS MPD/MPDA Vishay Thin Film Molded, SOT-143 Resistor Network FEATURES • • • • • Lead Pb -Free available Tight Ratio Tolerances to 0.05% ± 2ppm Tracking Standard Values Stocked Standard SOT-143 Footprint Pb-free Available TYPICAL PERFORMANCE

GR-326-CORE

Abstract: b055 FOTP-20 GR-326 durability EIA-455 EIA-455-171 Telcordia 326 transmission with applied tensile gr326core TIA-455-107A
Contextual Info: 501-611 Qualification Test Report 03Aug06 Rev B LC Duplex Die Cast Adapter Assembly 1. INTRODUCTION 1.1. Purpose Testing was performed on Tyco Electronics LC duplex die cast adapter assemblies to determine their conformance to the requirements of Product Specification 108-2230, Revision B.

8SDV0500

Abstract: 84-1LMI 221E-09
Contextual Info: 2.0-16.0 GHz GaAs MMIC Frequency Divider May 2005 - Rev 05-May-05 8SDV0500 Features Chip Device Layout tio n Divide-by-Four +5.0 dBm Output Power -30 dBc Fundamental Leakage Single-ended or Differential Input & Output 100% On-Wafer, DC and Output Power Testing

P1000 diode

Abstract: diode p1000 84-1LMI P1000 XB1004 XP1000 XU1000
Contextual Info: 17.0-24.0 GHz GaAs MMIC Power Amplifier P1000 May 2005 - Rev 05-May-05 Features Chip Device Layout High Linearity Output Amplifier Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 19.0 dB Small Signal Gain

IC 566 vco

Abstract: 6OSC0460 84-1LMI
Contextual Info: 5.5-6.5 GHz GaAs MMIC Voltage Controlled Oscillator May 2005 - Rev 05-May-05 6OSC0460 Features Chip Device Layout tio n On-Chip Resonator +4.5 dBm Output Power -97 dBc/Hz @ 100KHz Phase Noise 20mA @ -5.0V Bias Supply 100% On-Wafer, DC and Output Power Testing

Contextual Info: 24.0-34.0 GHz GaAs MMIC Power Amplifier 28MPA0304 May 2005 - Rev 05-May-05 Features Chip Device Layout tio n Excellent Saturated Output Stage 16.0 dB Small Signal Gain +24.0 dBm Saturated Output Power 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883

mmic distributed amplifier

Abstract: ultrasonic bond 22DSBA0423 84-1LMI
Contextual Info: 10.0-40.0 GHz GaAs MMIC Distributed Amplifier May 2005 - Rev 05-May-05 22DSBA0423 Features Chip Device Layout tio n Ultra Wide Band Driver Amplifier Self Biased Architecture 17.0 dB Small Signal Gain 5.0 dB Noise Figure 100% On-Wafer RF, DC and Output Power Testing

IC 566 vco

Abstract: vco mimix 7OSC0462 84-1LMI
Contextual Info: 6.4-7.4 GHz GaAs MMIC Voltage Controlled Oscillator May 2005 - Rev 05-May-05 7OSC0462 Features Chip Device Layout tio n On-Chip Resonator +5.0 dBm Output Power -97 dBc/Hz @ 100KHz Phase Noise 20mA @ -5.0V Bias Supply 100% On-Wafer, DC and Output Power Testing

VD-1-54

Contextual Info: 17.0-21.0 GHz GaAs MMIC Power Amplifier Velocium Products 18 - 20 GHz HPA - APH478 P1009 May 2005 - Rev 05-May-05 Features Chip Device Layout Excellent Linear Output Amplifier Stage 20.0 dB Small Signal Gain +29.5 dBm P1dB Compression Point +38.0 dBm Third Order Intercept OIP3

Contextual Info: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding

Contextual Info: VTF Vishay Thin Film Conformal, Single-In-Line Resistor Networks Standard FEATURES • Lead (Pb)-Free available Actual Size Pb-free • Off-the-shelf delivery Available • Wide variety of standards VISHAY Thin Film resistor networks are designed to be used in analog

Contextual Info: Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • Lead Pb -Free available • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier Actual Size • 16, 20, 24 terminal gold plated wraparound true hermetic

Contextual Info: VR Vishay Thin Film Molded, SOT-23 Resistor/Capacitor Network FEATURES • Lead Pb -Free available Pb-free Available • Resistor and capacitor integrated into a Thin Film Network • Filters at the source of emissions Vishay’s R/C Network, packaged in the standard SOT-23,

TOMC

Contextual Info: Vishay Thin Film Molded, 50 Mil Pitch Resistor Networks FEATURES • • • • • Actual Size Lead Pb -Free available 0.090" (2.29mm) maximum seated height Rugged, molded case construction (0.22" wide) Highly stable thin film Low temperature coefficient, ± 25ppm/°C

F0041

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 6 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AD 25 HOUSING 53.34[2.100] MAX — 44.65[1.758]— POST ,— 2.41 +- O0 . 018 .095 +- .00 00 43 -0.94+0.05 TYP [.037+.002]

Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AD 25 R E VIS IO N S LTR 01 1 15. 19[4.535] MAX HOUSING MATERIAL: POST MATERIAL: • 1 10.31+0.1 [4.343+.004] MARKING

nichrome

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT MP Vishay Thin Film Surface Mount Network FEATURES • Lead Pb -Free available Pb-free • Small physical size SC70 format MP 3 LEAD Available • Tight resistance ratio tolerances ± 0.05% • Low TC tracking ± 2ppm

resistors 1k ohm

Contextual Info: TSP Vishay Thin Film Molded, Commercial, Single-In-Line Resistor Network Standard FEATURES Actual Size Designed To Meet MIL-PRF-83401 Characteristic “V” and “H” These resistor networks are available in 6, 8 and 10 pin styles in both standard and custom circuits. They incorporate VISHAY

Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED BY TYCO ELECTRONICS CORPORATION. FOR PUBLICATION 5 4 2 3 - ALL RIGHTS RESERVED. LOC DIST AD 25 REVISIONS P LTR 0 1 DESCRIPTION DATE DWN 27JUN07 REVISED PER ECO-07-01 281 9 APVD DH DB HOUSING MATERIAL: GLASS-FILLED POLYMER.

Contextual Info: 2 THIS DRAWING I S UNPUBLI S HED. COPYRI GHT 20 RELEASED FOR PUBLI CATI ON BY TYCO ELECTRONI CS CORPORATION. ALL 20 LOC DE R 1GH T S RESERVED. R E V 1S I O N S DIST A5 P LTR DESCRI PTI ON R E V P E R ECO 0 8 - 0 2 5 6 8 5 B POSITIONING KEY DATE DWN 10-22-08