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DSAASSA0009124.pdf
by NXP Semiconductors
Partial File Text
NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's firs
Datasheet Type
Original
RoHS
Yes
Pb Free
Unknown
Lifecycle
Transferred
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PMEG4002ELD,315
DSAASSA0009124.pdf
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infocus
shear force
SOD882
SOD882D
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