DSAASSA0009329.pdf by NXP Semiconductors
- Reflow soldering footprint 1.4 0.2 solder lands 0.8 (2×) 0.6 (2×) 0.7 (2×) solder resist solder paste Dimensions in mm 0.3 0.4 1 1.3 sod882d_fr www.nxp.com © 2010 NXP B.V. All rights res
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