DSAASSA0009340.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of SO24 package SOT137-1 Hx Gx P2 (0.125) (0.125) Hy Gy By Ay C D2 (4x) P1 Generic footprint pattern D
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAASSA0009340.pdf preview

Download Datasheet

User Tagged Keywords

SO24 package SOT137