DSAASSA0009346.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of TSOP6 package 3.45 1.95 SOT457 0.95 3.3 2.825 0.95 0.45 0.55 (6×) (6×) 0.7 (6×) 0.8 (6×) 2.4 solder land solder p
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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