DSA005171.pdf by Bergquist

Partial File Text ® Gap Pad HC1000 "Gel-Like" Modulus Gap Filling Material Features and Benefits Typical Properties of Gap Pad HC1000 Property · Thermal conductivity 1.0 W/m-K Imperial Value Metric Va
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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ASTM d792 D2240 hc 1000 HC100 HC1000

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