DSADA0023021.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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BGA-256 BGA256 BGA256 17 BGA256 17 X 17 MS-034

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