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    DSADA0023080.pdf by Philips Semiconductors

    • PDF: 2002 May 22 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-1 c y exposed
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    HTQFP48 MS-026
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