DSADA0023085.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP32: plastic thermal enhanced thin quad flat package; 32 leads; body 5 x 5 x 1 mm; exposed die pad SOT547-1 c y exposed
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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