DSADA0023177.pdf by Philips Semiconductors

Partial File Text PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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