DSADA0023179.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D
Datasheet Type Original
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Pb Free Unknown
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