DSADA0023184.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Mar 18 Philips Semiconductors Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b v M C A B w M C x B D SOT639
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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