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    DSADA0023186.pdf by Philips Semiconductors

    • PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A B D SOT640-1 ball A1 inde
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    MO-195 TFBGA180
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