DSADA0023221.pdf by Philips Semiconductors

Partial File Text PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT703-1 b
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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HBGA432 SOT70 sot703