DSADA0023303.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Mar 14 Philips Semiconductors Package outline HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad D SOT793-1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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HTSSOP-56 HTSSOP56 sot793