DSADA0023352.pdf by Philips Semiconductors

Partial File Text PDF: 2004 Feb 19 Philips Semiconductors Package outline HLLGA68: plastic thermal enhanced low profile land grid array package; 68 lands; body 10 x 10 x 1.4 mm D SOT838-1 A B la
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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