This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
Hermetic Packages for Integrated Circuits
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1
-A-
D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C)
LEAD FINISH
8 LEAD CERAMIC DUAL-IN-LINE