DSAEDA000134579.pdf by Ohmite

Partial File Text SPECIFICATIONS TGH Series Material Heat Sink: Nickel-platedà¸copper Contacts: Nickel-platedà¸copper Substrate: Al203à¸(96%) Molding Compound: High-performanceà¸epoxy,à¸compliantà¸toà¸
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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