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I n t e r n a t i o n a l R e c t if ie r F w t l HEXFREDTM
(1)<2) Wafer Part Number (3) Di* Part Number DhAXB'Langth/Skb (iajmm Bond Pad `C X O' Unjth/SIb* (ln.)mm Anod* MetaSzation (topskk) Tray Qu
