DSAZIHA1000118211.pdf by KOA Speer Electronics

Partial File Text NETWORKS KOAÂ´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON (TFOS) KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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