DSA2IH0073575.pdf by Not Available

Partial File Text Direct Copper Bonded (DCB) Ceramic Substrates Uncladed ceramic Purity Dielectric strength Electrical resistivity Thermal conductivity Dim ensions Thickness Aluminium Oxide > 96 % 10 kV/mm > 1
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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