DSA0016950.pdf by Texas Instruments

Partial File Text Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array (TFBGA) meets dimensions spec
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054UG08C127 56ZQL 63 ball Vfbga thermal resistance APR-5000 BGA Ball Crack jesd 51-7 metcal apr 5000 MO-205