DSA00269217.pdf by Central Semiconductor

Partial File Text PROCESS CP316V Small Signal Transistors NPN - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 7.1 MILS Base Bondi
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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2N5551 2n5551 chip AL transistor CMPT5551 CP316V CXT5551 CZT5551