DSA00269327.pdf
by Central Semiconductor
- CPQ090 PROCESS TRIAC 4.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 90 x 90 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Are
- Original
- No
- No
- Active
- Find it at Findchips.com
