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    DSA00269331.pdf by Central Semiconductor

    • PROCESS CPS053 Silicon Controlled Rectifier 2.0 Amp Sensitive Gate SCR Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 53 x 53 MILS Die Thickness 8.7 MILS Cath
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    CPS053 CS223-2M CS92-2M MCR22-6
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