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DSASCANS15-62937.pdf
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RevNo A L 1. Wafer Material: PA 66+20%GF UL94V-0 W ave soldering temperature limit: 260°C ±5,10±0.5Sec. Contact Material: Copper Alloy 2. Plated: Tin-plated 50u"min. 3. Insulation resist
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RoHS
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Pb Free
Unknown
Lifecycle
Unknown
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