DSACRA000020135.pdf by HOLT Integrated Circuits

Partial File Text Assembly Location and Mold Compound Change for QFN Packages Product Change Notice Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufacture
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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7470-LA G770* sumitomo G770H GE mold compound GE-74 GE-7470L-A HI-1573PCIF HI-1579PCI HI-3582PCI-10 mold compound Nitto nitto GE sumitomo g770h

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