DSASL00157994.pdf

Partial File Text Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621/623 SERIES Footprint Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 4.750 (120.6) x 1.500 (38.1) 4.7
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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